1984-02-01

A Thermal Model for Audio Power Amplifiers 840163

This paper develops a thermal model for analyzing transient and steady state heat flow in power amplifier heat sinks. This model is used to predict I.C. junction and heat sink temperatures, power output, and power dissipation over any time interval. Methods of determining heat sink parameters are discussed followed by a comparison of measured versus calculated data on a two channel power amplifier.

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