1985-02-01

IC Chip on PWB Development for an Automobile Clock 850138

In recent years, considerable effort has been directed to reducing the size while increasing the feature content of electronic products in an automobile. One method of achieving this task is to mount integrated circuits in die form directly to a printed circuit board. This method is known as “IC Chip On Board”. The elimination of an IC package results in a significant size reduction of electronic modules.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 43% off list price.
Login to see discount.
Special Offer: With TechSelect, you decide what SAE Technical Papers you need, when you need them, and how much you want to pay.
X