1987-02-01

Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications 870209

This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 43% off list price.
Login to see discount.
Special Offer: With TechSelect, you decide what SAE Technical Papers you need, when you need them, and how much you want to pay.
X