Intel's Package Development Group began development of Tape Automated Bonding (TAB) (See Figure 1) for two primary purposes: as a lead frame to device interconnect for high lead count products; and, as a stand-alone for surface-mounted-devices (SMD). New production assembly equipment, bumping equipment and tape technology have made it possible for TAB to become production-worthy.
Intel, over the past few years, has made progress in the development of TAB technology. Using a 16-bit micro-controller as the process characterization vehicle, numerous milestones have been accomplished: tape design, carrier design, and assembly development. The 16-bit micro-controller has been tested to an Automotive product type flow and a number of piece part specifications have been generated. In addition, much of the production equipment has been characterized, and process characterization is well under way.