A soft, clear, jello-like, fuel resistant fluorosilicone gel has been developed. The produce is supplied as a two component solvent free low viscosity liquid that when mixed in a 1 to 1 ratio cures to form the gel. This gel can be used to protect electronic components or circuitry from dust, dirt, fuels or solvents in both a hot (up to 150°C) or cold (down to −65°C) environments. After 7 days immersion in gasoline the gel swells only 12% where similar gels based upon dimethyl silicone will swell over 100% and lose their integrity. This new fuel resistant gel is based upon a very pure low molecular weight trifluoropropylmethyl polysiloxane polymer that is cured using the platinum catalyst addition reaction which is heat accelerated and produces no shrinkage or by products. This paper will discuss the chemistry, properties and applications of this new unique fluorosilicone gel.