Use of Computerized Mold Filling Analysis in Predicting the Quality of Molded Plastic Instrument Panel Attachment Bosses 900728
In order to more fully explain variations in the performance of instrument panel (IP) structural attachment bosses of molded plastic, computerized mold filling analysis was performed on a mold cavity and its melt distribution system (manifold, drops, runners and gates). A comparison of the simulated filling pattern with measured boss stripping torques showed a correlation between boss quality and the conditions experienced by the melt during the molding process.
By optimizing the diameters of various flow channels in the mold, an improvement in the quality of certain “problem” bosses is anticipated. Balancing of the filling pattern to improve boss performance is also expected to enhance the processability of the mold.
Recommendations which resulted from this study are currently being implemented to quantify benefits and substantiate conclusions. If successful, design engineers will have another tool to provide confidence in using structural attachment bosses on molded plastic instrument panels.