1992-08-03

SPICE Models for Thermal and Vibration Analysis of Printed Circuit Boards 929318

This paper describes circuit models for characterizing the thermal and dynamic behavior of printed circuit boards. The thermal model simulates the transient temperature distribution resulting from dissipative components and conductive, convective, and radiative boundaries. The dynamic model predicts the fundamental frequency for clamped edges. Both models are based on finite difference equations and confirmed by traditional methods.

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