The stress relaxation for a model connector has been simulated using the Finite Element Method. In the model the steady state temperature field, the stresses and the contact loads are calculated. Input data include the connector geometry and known material data such as results from stress relaxation testing.Simulation of different alloys and conditions such as ambient temperature, currents, contact resistance and cooling conditions have been performed. Examined material were common copper alloys used for connectors. The alloys had a wide variation in electrical conductivity from 14 to 96 % IACS.The results show that the model facilitates selection of the alloy for given conditions. At this stage this may be of great practical value since design and testing of a connector are expensive.