1994-04-01

Spray Cooling of a High Power Laser Diode 941183

In laser diodes arrays, integrated circuits mounted together on a single substrate to form one level package allow higher laser intensities, varied frequencies at enormous size and weight savings. However, with the denser packaging and higher intensities is introduced a higher heat dissipation. Under conditions of high-heat-flux the temperatures and thermal gradients within the laser device can become considerable. This effort illustrates that by spray cooling the laser diode not only can the optical efficiency (increased by 33%) and power input (increased by 75%) be increased significantly but also the laser package can be reduced in size by a factor of ten or more.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 43% off list price.
Login to see discount.
Special Offer: Purchase more aerospace standards and aerospace material specifications and save! AeroPaks off a customized subscription plan that lets you pay for just the documents that you need, when you need them.
X