Experimental and Computer Simulation Analysis of Transients on an Automobile Communication Bus 950038
Voltage and current surges are a major concern when it comes to ensuring the functional integrity of electrical and electronic components and modules in an automobile system. This paper presents a computer simulation study for analyzing the effect of high voltage spikes and current load dump on a new Integrated Driver/Receiver (IDR) IC, currently being developed for a J1850 Data Communication Bus in an automobile. It describes the modeling and simulation of the protection structure proposed for the device. The simulation study yields a prediction of current and voltage capability of the protection circuit based on thermal breakdown and transient responses of the circuit. Two levels of modeling, namely, the behavioral level model and the component level model, are used to generate the simulation results. Experimental data will be acquired and used to validate the simulation model when the actual device becomes available.
Citation: Cheok, K., McCune, D., Hormel, R., and Miesterfeld, F., "Experimental and Computer Simulation Analysis of Transients on an Automobile Communication Bus," SAE Technical Paper 950038, 1995, https://doi.org/10.4271/950038. Download Citation
Ka C. Cheok, Donald J. McCune, R. Hormel, F. Miesterfeld
Oakland Univ., Chrysler Corp.
International Congress & Exposition
Automotive Multiplexing Technology-SP-1070, Multiplexing and Networking-PT-78, SAE 1995 Transactions: Journal of Passenger Cars-V104-6