An integrated manifold pressure sensor using bulk silicon micromachining techniques is presented. The sensor incorporates the entire signal amplification, temperature compensation, and circuitry for electronic trimming of the sensor chip. The chip circuitry and the manufacturing and assembly process will be discussed. Trimming of the sensitivity and offset production tolerances as well as the temperature coefficients of sensitivity and offset is performed using an electrical trim method. A binary coded digital compensation information is serially fed into an on-chip control unit. The individual bits are decoded and sent to the gates of a bank of trimming thyristors. Once the correct binary code has been selected so that the sensor characteristic is centered in the specified range, the programming voltage is increased and the data is irreversibely stored similarly to the zener zapping method.