1995-02-01

Integrated Silicon Pressure Sensor for Automotive Application with Electronic Trimming 950533

An integrated manifold pressure sensor using bulk silicon micromachining techniques is presented. The sensor incorporates the entire signal amplification, temperature compensation, and circuitry for electronic trimming of the sensor chip. The chip circuitry and the manufacturing and assembly process will be discussed. Trimming of the sensitivity and offset production tolerances as well as the temperature coefficients of sensitivity and offset is performed using an electrical trim method. A binary coded digital compensation information is serially fed into an on-chip control unit. The individual bits are decoded and sent to the gates of a bank of trimming thyristors. Once the correct binary code has been selected so that the sensor characteristic is centered in the specified range, the programming voltage is increased and the data is irreversibely stored similarly to the zener zapping method.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 18% off list price.
Login to see discount.
Special Offer: Download multiple Technical Papers each year? TechSelect is a cost-effective subscription option to select and download 12-100 full-text Technical Papers per year. Find more information here.
We also recommend:
TECHNICAL PAPER

SOI Type Pressure Sensor for High Temperature Pressure Measurement

940634

View Details

TECHNICAL PAPER

Touch Mode Capacitive Pressure Sensors for Automotive Applications

962200

View Details

TECHNICAL PAPER

Automated Trimming of Composite Panels

861625

View Details

X