1996-05-01

Thermal Physics of Failure 961266

Temperature changes cause thermo-mechanical stresses and creep in solder joints of electronics. These conditions induce cracking in the solder and eventual failure of the electronic component. This paper describes procedures for predicting the lifetime to failure of electronics exposed to thermal cycling.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 43% off list price.
Login to see discount.
Special Offer: With TechSelect, you decide what SAE Technical Papers you need, when you need them, and how much you want to pay.
X