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This document defines: 1 A default method for those companies that require a pre-defined approach and 2 A protocol for those companies that wish to develop their own test methods. The default method (Section 4 of the document) is intended for use by electronic equipment manufacturers, repair facilities, or programs which, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Pb-free solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment.

This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin finishes in electronic systems. This Standard is applicable to Aerospace, Defense, and High Performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

This document provides an industry standard for Long Term Storage (LTS) of electronic devices by drawing from the best long term storage practices currently known. LTS is defined as any device storage for more than 12 months but typically allows for much longer (years). While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. This standard is not intended to address built-in failure mechanisms (e.g., tin whiskers, plating diffusion, and intermetallics) that would take place regardless of storage conditions

This handbook details the TechAmerica Technical Fellowship Selection Process. It identifies the tasks to be performed and associates them with participants in the process. The focus is intended to keep the process implementation as uniform as possible. There are three types of information in this handbook: Process details Candidate Application Package format Process infrastructure and description Each Section of this handbook describes a significant segment of the selection process. There are also appendices that contain a variety of supporting material relevant to the different process participants.

This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics. This document is intended for application to aerospace products; however, it may also be applied, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged use environments, high reliability, long lifetime, and reparability. If other industries wish to use this document, they may substitute the name of their industry for the word “Aerospace” in this document.

This style manual establishes requirements for the preparation of standards1) and certain other publications of TechAmerica. It also gives some indication with regard to presentation.

The TechAmerica Standards & Technology department is responsible for standardization activities, and provides other appropriate technical and engineering services within the scope of TechAmerica by-laws. Standardization activities shall include those associated with Business, Engineering, and Operations Management and Processes. All activities shall be conducted in accordance with appropriate legal guidance.

This handbook is intended to assist the user to understand the ANSI/EIA-649B standard principles and functions for Configuration Management (CM) and how to plan and implement effective CM. It provides CM implementation guidance for all users (CM professionals and practitioners within the commercial and industry communities, DoD, military service commands, and government activities (e.g., National Aeronautics and Space Administration (NASA), North Atlantic Treaty Organization (NATO)) with a variety of techniques and examples. Information about interfacing with other management systems and processes are included to ensure the principles and functions are applied in each phase of the life cycle for all product categories.

This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, “Performance Standard for Aerospace and High Performance Electronic Systems Containing Pb-free Solder”. Please note that the program manager, and managers of systems engineering, Supply Chain and Quality Assurance (along with their respective organizations), and the appropriate enterprise authority need to work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein “program management (or manager), supplier chain management (or manager), quality assurance management (or manager) and systems engineering management (or manager) and/or the appropriate enterprise authority” shall be defined as “responsible manager” throughout the remaining document (see Section 3, Terms and Definitions).

This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish.

This document prescribes processes for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. It applies to any designer or manufacturer of equipment intended to operate under conditions tht require semiconductor devices to function in temperature ranges beyond those for which the devices are marketed. This document is intended for applications in which only the performance of the device is an issue. Even though the device is used at wider temperatures, the wider temperatures will be limited to those that do not compromise the system performance or application-specific reliability of the device in the application. Specifically, this document is not intended for applications that require the device to function at an operating or environmental stress level that significantly increases the risk of catastrophic device failure, loss of equipment function, or unstable operation of the device.

This handbook is intended to provide additional information on the use and tailoring of the data in GEIA-STD-0007. The standard provides a new approach to Logistics Support Analysis Record (LSAR) (i.e., MIL-STD-1388-2B) data with emphasis on data transfer (e.g., XML Schemas) versus data storage (e.g., relational tables). GEIA-STD-0007 identifies the range of logistics product data that is generated during the development and acquisition of a system or end item. It does not prescribe the supportability analyses required to generate logistics product data. How the data is generated via analysis techniques/tools, how it is stored and processed, and how the data is used to generate specific logistics support products, is left to the performing activity. GEIA-STD-0007 is a data transfer standard implementing the logistics data concepts of GEIA-STD-927, Common Data Schema for Complex Systems.

This Standard specifies the minimum derating requirements for using electronic components in moderately severe environments. These environments are assumed to include Airborne Inhabited Cargo (AIC), Airborne Inhabited Fighter (AIF), Ground Mobile (GM), and Naval Sheltered (NS) environments specified in MIL-HDBK-217. This Standard is intended to supersede the derating limits contained in Defense Standardization Program Office (DSPO) Standardization Directive SD-18, Naval Standard TE000-AB-GTP-010, and Air Force ESD-TR-85-148. It is intended that a future revision of this Standard will include additional requirements for derating for other environments (e.g. Airborne Uninhabited Cargo). Since this Standard specifies the minimum derating requirements, (sub)contractors may derate in excess of these requirements.

The primary focus of this standard is information of interest to Configuration Management (CM) practitioners related to the performance of CM functions as products are conceived, proposed, defined, developed, produced, operated, maintained, modified, and disposed. This information is stored when generated and, from time to time, must be moved or shared with others. This standard, through the use of the Data Dictionary, defines real world things of interest to the CM practitioner, which are the foundation of the following CM functional areas, and are needed for effective data exchange and interoperability: Configuration Management Planning and Management Configuration Identification Configuration Change Management Configuration Audit Configuration Verification Configuration Status Accounting The Data Dictionary [21] defines terms that are used to define these objects of interest, which are listed below.

This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “Rework/Repair” is used as applicable. NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.

This Standard applies to integrated circuits and semiconductors exhibiting the following attributes: a A minimum set of requirements, or information provided by the part manufacturer, which will allow a standard COTS component to be designated AQEC by the manufacturer. b As a minimum, each COTS component (designated AQEC) will have been designed, fabricated, assembled, and tested in accordance with the component manufacturer’s requirements for standard data book components. c Qualification of, and quality systems for, the COTS components to be designated as AQEC shall include the manufacturer’s standards, operating procedures, and technical specifications. d Components manufactured before the manufacturer has addressed AQEC requirements, but utilizing the same processes, are also considered AQEC compliant. e Additional desired attributes of a device designated AQEC (that will support AQEC users) are found in Appendix B of this standard.

This guide clearly defines the purpose, goals, and objectives of an IBR. It also describes the attributes of an effective IBR and discusses a baseline review process that will lead to a better understanding of program risks. It provides a common definition and framework for the IBR Process. This process harmonizes, and to the extent possible, unifies the management objectives for all PMs. The IBR Process enables managers to effectively utilize the project Performance Measurement Baseline (PMB) to assess performance, and to better understand inherent risks. The IBR Process should continue throughout the life of a project.

This Bulletin provides a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware. It is not a mandate nor does it contain any requirements. A tin whisker is a single crystal that emerges from tin-finished surfaces. Tin whiskers can pose a serious reliability risk to electronic assemblies that have pure tin finish. The general risks fall into several categories: [1, 2, 3, 8, 16] Short Circuits: The whisker can create a short circuit, either by 1) growing from an area at one potential to an area at another or 2) breaking free and later bridging these areas. In some cases, these shorts may be permanent and cause catastrophic system failures. A transient short may result if the available current exceeds the fusing current of the whisker, and the whisker can fuse open.

The federal government and industry have moved to concurrent acquisition and development processes using integrated process teams (IPTs). These processes are supported by timely, accurate, cross functional access to data within an integrated data environment (IDE) enabled by advances in information technology (IT). Since the advent of acquisition reform in 1994, Data Management (DM) practices have evolved from being directed by a prescriptive set of standards and procedures to use of the guidance in a principles-based standard -- ANSI/EIA 859.

GEIA Handbook 859 provides implementation guidance for ANSI/EIA 859, with discussions of applications of the standard's principles, tools, examples, and case studies. Handbook 859 is organized according to the lifecycle of data management and covers activities from the pre-RFP stage through records disposition.