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This document defines: 1 A default method for those companies that require a pre-defined approach and 2 A protocol for those companies that wish to develop their own test methods. The default method (Section 4 of the document) is intended for use by electronic equipment manufacturers, repair facilities, or programs which, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Pb-free solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment.

This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “Rework/Repair” is used as applicable. NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.

This Standard applies to integrated circuits and semiconductors exhibiting the following attributes: a A minimum set of requirements, or information provided by the part manufacturer, which will allow a standard COTS component to be designated AQEC by the manufacturer. b As a minimum, each COTS component (designated AQEC) will have been designed, fabricated, assembled, and tested in accordance with the component manufacturer’s requirements for standard data book components. c Qualification of, and quality systems for, the COTS components to be designated as AQEC shall include the manufacturer’s standards, operating procedures, and technical specifications. d Components manufactured before the manufacturer has addressed AQEC requirements, but utilizing the same processes, are also considered AQEC compliant. e Additional desired attributes of a device designated AQEC (that will support AQEC users) are found in Appendix B of this standard.

This document provides an industry standard for Long Term Storage (LTS) of electronic devices by drawing from the best long term storage practices currently known. LTS is defined as any device storage for more than 12 months but typically allows for much longer (years). While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. This standard is not intended to address built-in failure mechanisms (e.g., tin whiskers, plating diffusion, and intermetallics) that would take place regardless of storage conditions

This standard requires the developers and customer/users working as a team to plan and implement a reliability program that provides systems/products that satisfy the user’s requirements and expectations. The user’s requirements and needs are expressed in the form of the following four reliability objectives: The developer shall solicit, investigate, analyze, understand and agree to the user’s requirements and product needs. The developer, working with the customer and user, shall include the activities necessary to ensure that the user’s requirements and product needs are fully understood and defined, so that a comprehensive design specification and Reliability Program Plan can be generated. The developer shall use well-defined reliability- and systems-engineering processes to develop, design, and verify that the system/product meets the user’s documented reliability requirements and needs.

This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin finishes in electronic systems. This Standard is applicable to Aerospace, Defense, and High Performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

Data is information (e.g., concepts, thoughts, and opinions) that have been recorded in a form that is convenient to move or process. Data may represent tables of values of various types (numbers, characters, and so on). Data can also take more complex forms such as engineering drawings and other documents, software, pictures, maps, sound, and animation. For the purpose of this standard, Table 1 lists three broad types of data, indicates how each is used, and provides examples of each. Data management, from the perspective of this standard, consists of the disciplined processes and systems that plan for, acquire, and provide stewardship for product and product-related business data, consistent with requirements, throughout the product and data life cycles. Thus, this standard primarily addresses product data and the business data required for collaboration from the team level or extended through the trading partner level during product acquisition and sustainment.

This handbook provides guidance about the use of CM and about CM's interface with other management systems and procedures. The paragraph numbers in this handbook map directly to the paragraph numbers in ANSI/EIA-649. It is applicable to the support of projects throughout all phases of a product's life cycle. Generic CM examples are included which may be tailored, taking into account the complexity and nature of the work and the product. It is applicable to the support of projects throughout all phases of a products life cycle. Generic CM examples are included and may be tailored to suit the complexity and nature of the work and the product. This handbook establishes a common framework for generic product life cycle CM. It addresses tailored implementation based on differences that may exist in organization policies and procedures, in the phase of the product life cycle, in the acquisition method, in the project size and complexity, and in the system requirements and development.

This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish.

This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish.

This standard defines the requirements for fully replacing undesirable surface finishes using solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic and semi-automatic dipping process but does not cover purely manual dipping processes, due to the lack of understanding of the appropriate requirements for hand-dipping for tin whisker mitigation at this time. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish.

This handbook is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance. Programs may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board finish, or assembly solder) if careful coordination between buyer and supplier is not exercised. For example, piece part manufacturers may not always change part numbers to identify Pb-free finishes, especially if the previous tin-lead (Sn/Pb)-finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection while crucial, may not be sufficient to identify Pb-free piece parts. Note: Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations.

This document outlines a standard practice for conducting system safety. The system safety practice as defined herein provides a consistent means of evaluating identified risks. Mishap risk must be identified, evaluated, and mitigated to a level as low as reasonably practicable. The mishap risk must be accepted by the appropriate authority and comply with federal (and state, where applicable) laws and regulations, executive orders, treaties, and agreements. Program trade studies associated with mitigating mishap risk must consider total life cycle cost in any decision. This document is intended for use as one of the elements of project solicitation for complex systems requiring a systematic evaluation of safety hazards and mitigating measures. The Managing authority may identify, in the solicitation and system specification, specific system safety engineering requirements to be met by the Developer.

This Standard applies to integrated circuits and semiconductors exhibiting the following attributes: a A minimum set of requirements, or information provided by the part manufacturer, which will allow a standard COTS component to be designated AQEC by the manufacturer. b As a minimum, each COTS component (designated AQEC) will have been designed, fabricated, assembled, and tested in accordance with the component manufacturer’s requirements for standard data book components. c Qualification of, and quality systems for, the COTS components to be designated as AQEC shall include the manufacturer’s standards, operating procedures, and technical specifications. d Components manufactured before the manufacturer has addressed AQEC requirements, but utilizing the same processes, are also considered AQEC compliant. e Additional desired attributes of a device designated AQEC (that will support AQEC users) are found in Appendix B of this standard.

This standard requires the developers and customer/user’s working as a team to plan and implement a reliability program that provides systems/products that satisfy the user’s requirements and expectations. The user’s requirements and needs are expressed in the form of the following four reliability objectives: The developer shall solicit, investigate, analyze, understand and agree to the user’s requirements and product needs. The developer, working with the customer and user, shall include the activities necessary to ensure that the user’s requirements and product needs are fully understood and defined, so that a comprehensive design specification and Reliability Program Plan can be generated. The developer shall use well-defined reliability- and systems-engineering processes to develop, design, and verify that the system/product meets the user’s documented reliability requirements and needs.