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This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. It is intended to communicate requirements for a Pb-free Control Plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan Owners in the development of their own Plans. The Plan documents the Plan Owner’s processes that assure their customers, and all other stakeholders that the Plan Owner’s products will continue to meet their requirements, given the risks stated in the Introduction. This standard does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that must be addressed by the processes.

The purpose of this handbook is to provide the data modeler with the modeling conventions, philosophy and guidelines used during development of the GEIA-STD-927 schema; and the integration process used to integrate existing best-in-class standard data models into the GEIA-STD-927 schema. Most importantly, the handbook provides tailoring guidelines for the data modeler to use in applying the GEIA-STD-927 schema and mapping tables to a practical application for an existing program. The Handbook is organized into four sections: Data Modeling Guidelines, Data Model Usage Guide, Integration Procedure, and Schema Tailoring Guidelines

This handbook is intended to provide additional information on the use and tailoring of the data in GEIA-STD-0007. The standard provides a new approach to Logistics Support Analysis Record (LSAR) (i.e., MIL-STD-1388-2B) data with emphasis on data transfer (e.g., XML Schemas) versus data storage (e.g., relational tables). GEIA-STD-0007 identifies the range of logistics product data that is generated during the development and acquisition of a system or end item. It does not prescribe the supportability analyses required to generate logistics product data. How the data is generated via analysis techniques/tools, how it is stored and processed, and how the data is used to generate specific logistics support products, is left to the performing activity. GEIA-STD-0007 is a data transfer standard implementing the logistics data concepts of GEIA-STD-927, Common Data Schema for Complex Systems.

GEIA-STD-927 specifies the data concepts to be exchanged to share product information pertaining to a complex system from the viewpoints of multiple disciplines. It supports the exchange of data across the entire life cycle for the product from the concept stage through disposal.

The federal government and industry have moved to concurrent acquisition and development processes using integrated process teams (IPTs). These processes are supported by timely, accurate, cross functional access to data within an integrated data environment (IDE) enabled by advances in information technology (IT). Since the advent of acquisition reform in 1994, Data Management (DM) practices have evolved from being directed by a prescriptive set of standards and procedures to use of the guidance in a principles-based standard -- ANSI/EIA 859.

GEIA Handbook 859 provides implementation guidance for ANSI/EIA 859, with discussions of applications of the standard's principles, tools, examples, and case studies. Handbook 859 is organized according to the lifecycle of data management and covers activities from the pre-RFP stage through records disposition.

This handbook is intended to assist the user to understand the ANSI/EIA-649B standard principles and functions for Configuration Management (CM) and how to plan and implement effective CM. It provides CM implementation guidance for all users (CM professionals and practitioners within the commercial and industry communities, DoD, military service commands, and government activities (e.g., National Aeronautics and Space Administration (NASA), North Atlantic Treaty Organization (NATO)) with a variety of techniques and examples. Information about interfacing with other management systems and processes are included to ensure the principles and functions are applied in each phase of the life cycle for all product categories.

This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics. This document is intended for application to aerospace products; however, it may also be applied, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged use environments, high reliability, long lifetime, and reparability. If other industries wish to use this document, they may substitute the name of their industry for the word "Aerospace" in this document.

This document outlines a standard practice for conducting system safety. In some cases, these principles may be captured in other standards that apply to specific commodities such as commercial aircraft and automobiles. For example, those manufacturers that produce commercial aircraft should use SAE ARP4754 or SAE ARP4761 (see Section 2 below) to meet FAA or other regulatory agency system safety-related requirements. The system safety practice as defined herein provides a consistent means of evaluating identified risks. Mishap risk should be identified, evaluated, and mitigated to a level as low as reasonably practicable. The mishap risk should be accepted by the appropriate authority and comply with federal (and state, where applicable) laws and regulations, executive orders, treaties, and agreements. Program trade studies associated with mitigating mishap risk should consider total life cycle cost in any decision.

This document defines: (1) A default method for those companies that require a pre-defined approach and (2) A protocol for those companies that wish to develop their own test methods.

The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs which, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Pb-free solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment.

This document provides an industry standard for Long Term Storage (LTS) of electronic devices by drawing from the best long term storage practices currently known. LTS is defined as any device storage for more than 12 months but typically allows for much longer (years). While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. This standard is not intended to address built-in failure mechanisms (e.g., tin whiskers, plating diffusion, and intermetallics) that would take place regardless of storage conditions

This Standard specifies the minimum derating requirements for using electronic components in moderately severe environments. These environments are assumed to include Airborne Inhabited Cargo (AIC), Airborne Inhabited Fighter (AIF), Ground Mobile (GM), and Naval Sheltered (NS) environments specified in MIL-HDBK-217. This Standard is intended to supersede the derating limits contained in Defense Standardization Program Office (DSPO) Standardization Directive SD-18, Naval Standard TE000-AB-GTP-010, and Air Force ESD-TR-85-148. It is intended that a future revision of this Standard will include additional requirements for derating for other environments (e.g. Airborne Uninhabited Cargo). Since this Standard specifies the minimum derating requirements, (sub)contractors may derate in excess of these requirements.

This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin finishes in electronic systems. This Standard is applicable to Aerospace, Defense, and High Performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

This document provides risk mitigation for Pb-free solders used internal to parts used in Aerospace and Defense applications. It will include mitigations applicable to encapsulated and cavity devices as the needs arise in industry. Currently this revision only addresses devices with encapsulation or underfill. Mitigations for open cavity devices are still being discussed, and will be addressed in future revisions. Microbumps with Thermal Compression Bonding (TCB) are not addressed by the mitigations in this document. The use of Pb-free microbumps with TCB are considered out of scope at this time. It is expected that this document will be primarily used by Control Levels 3 and 2C (as defined in GEIA-STD-0005-2 for programs that do not allow use of Pb-free tin or only allow its use on an exception basis). It may be used by other levels, or by applications not using GEIA-STD-0005-2.

SAE TA-HB-0007-1A is an integral part of the following suite of documents, which are meant to be used together: SAE TA-STD-0017A, Product Support Analysis, SAE GEIA-STD-0007C, Logistics Product Data, SAE GEIA-HB-0007B, Logistics Product Data Handbook, and SAE TA-HB-0007-1A. MIL-HDBK-502A, Product Support Analysis provides additional guidance and instruction applicable to United States DoD programs. SAE TA-STD-0017A Product Support Analysis is a standard which prescribes a set of analysis activities for designing support and supporting the design of a product. MIL-HDBK-502A provides DoD users with implementation guidance for SAE TA-STD-0017A. The results of the analysis are Logistics Product Data. SAE GEIA-HB-0007B is a companion handbook to SAE GEIA-STD-0007C.

This Handbook provides “how to” guidance to industry and government for the reliability Activities and Methods contained in GEIASTD0009 for developing reliable products and systems, successfully demonstrating them during test and evaluation, and sustaining them throughout the system/product life cycle. GEIASTD0009 requires the developers and customer/users working as a team to plan and implement a reliability program that provides systems/products that satisfy the user’s requirements and expectations using a systems engineering approach. The four Objectives of GEIASTD0009 are listed below: Objective 1: Understand customer/user requirements and constraints. The team (developer, customer, and user) includes the Activities necessary to ensure that the user’s requirements and product needs are fully understood and defined, so that a comprehensive design specification and Reliability program plan are generated. Objective 2: Design and redesign for reliability.

The primary focus of this standard is information of interest to Configuration Management (CM) practitioners related to the performance of CM functions as products are conceived, proposed, defined, developed, produced, operated, maintained, modified, and disposed. This information is stored when generated and, from time to time, must be moved or shared with others. This standard, through the use of the Data Dictionary, defines real world things of interest to the CM practitioner, which are the foundation of the following CM functional areas, and are needed for effective data exchange and interoperability: Configuration Management Planning and Management Configuration Identification Configuration Change Management Configuration Audit Configuration Verification Configuration Status Accounting The Data Dictionary [21] defines terms that are used to define these objects of interest, which are listed below.

This standard defines five CM functions and their underlying principles. The functions are detailed in Section 5. The principles, highlighted in text boxes, are designed to individually identify the essence of the related CM function and can be used to collectively create a checklist of “best practice” criteria to evaluate a CM program. The CM principles defined in this standard apply equally to internally focused enterprise information, processes, and supporting systems (i.e., Enterprise CM - policy driven, supporting the internal goals needed to achieve an efficient, effective and lean enterprise), as well as to the working relationships supported by the enterprise (i.e., Acquirer/Supplier CM - contracted relationship to support external trusted interaction with suppliers).

This document provides guidance for the use of international standards for the maintenance of lead-free electronic equipment. The purpose is to assist manufacturers, maintenance facilities, and operators to define lead-free soldering requirements and to minimize the set of lead-free solders, processes, and practices to gain consistency across the industry.

This document prescribes processes for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. It applies to any designer or manufacturer of equipment intended to operate under conditions tht require semiconductor devices to function in temperature ranges beyond those for which the devices are marketed. This document is intended for applications in which only the performance of the device is an issue. Even though the device is used at wider temperatures, the wider temperatures will be limited to those that do not compromise the system performance or application-specific reliability of the device in the application. Specifically, this document is not intended for applications that require the device to function at an operating or environmental stress level that significantly increases the risk of catastrophic device failure, loss of equipment function, or unstable operation of the device.

This standard defines five CM functions and their underlying principles. The functions are detailed in Section 5. The principles, highlighted in text boxes, are designed to individually identify the essence of the related CM function, and can be used to collectively create a checklist of criteria to evaluate a CM program. In describing each CM function and its principles, this standard utilizes neutral Configuration Management terminology, while also providing equivalent terms, that have historically been used in various product environments (see Table 2). There is no intent to express preference for any particular set of terminology. Similarly, this standard uses a neutral set of names for the phases of a product’s life cycle, which are generic enough to be easily mapped to the myriad of different life cycle models in use. Table 1 illustrates some of the aliases for each phase name and identifies characteristics that apply in each one.