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As an integral part of the evolution to ANSI/GEIA-859 and the new environment, data management ensures that appropriate information support is available. Data requirements are established that ensure that data are properly timed and accessible, and provide the necessary visibility. The integrity of the data must be ensured regardless of their physical location. The DM process, implemented with rapidly maturing technologies, makes information available sooner and facilitates information sharing. It controls the digital format and the procedures necessary to exchange, index, store, and distribute or provide access to data.

SAE GEIA-STD-0007C defines logistics product data generated during the requirement definition and design of an industry or government system, end item, or product. It makes use of the Extensible Markup Language (XML) through the use of entities and attributes that comprise logistics product data and their definitions. The standard is designed to provide users with a uniform set of data tags for all or portions of logistics product data. The standard can be applied to any industry or government product, system or equipment acquisition program, major modification program, and applicable research and development projects. This standard is for use by both industry and government activities. As used in this standard, the requiring authority is generally the customer and the customer can be a government or industry activity. The performing activity may be either a industry or government activity.

This handbook is intended to provide additional information on the use and tailoring of the data in GEIA-STD-0007. The standard provides a new approach to Logistics Support Analysis Record (LSAR) (i.e., MIL-STD-1388-2B) data with emphasis on data transfer (e.g., XML Schemas) versus data storage (e.g., relational tables). GEIA-STD-0007 identifies the range of logistics product data that is generated during the development and acquisition of a system or end item. It does not prescribe the supportability analyses required to generate logistics product data. How the data is generated via analysis techniques/tools, how it is stored and processed, and how the data is used to generate specific logistics support products, is left to the performing activity. GEIA-STD-0007 is a data transfer standard implementing the logistics data concepts of GEIA-STD-927, Common Data Schema for Complex Systems.

SAE TA-HB-0007-1A is an integral part of the following suite of documents, which are meant to be used together: SAE TA-STD-0017A, Product Support Analysis, SAE GEIA-STD-0007C, Logistics Product Data, SAE GEIA-HB-0007B, Logistics Product Data Handbook, and SAE TA-HB-0007-1A. MIL-HDBK-502A, Product Support Analysis provides additional guidance and instruction applicable to United States DoD programs. SAE TA-STD-0017A Product Support Analysis is a standard which prescribes a set of analysis activities for designing support and supporting the design of a product. MIL-HDBK-502A provides DoD users with implementation guidance for SAE TA-STD-0017A. The results of the analysis are Logistics Product Data. SAE GEIA-HB-0007B is a companion handbook to SAE GEIA-STD-0007C.

This document provides an industry standard for Long Term Storage (LTS) of electronic devices by drawing from the best long term storage practices currently known. LTS is defined as any device storage for more than 12 months but typically allows for much longer (years). While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. This standard is not intended to address built-in failure mechanisms (e.g., tin whiskers, plating diffusion, and intermetallics) that would take place regardless of storage conditions

This document provides an industry standard for Long Term Storage (LTS) of electronic devices by drawing from the best long term storage practices currently known. LTS is defined as any device storage for more than 12 months but typically allows for much longer (years). While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this standard precludes the storage of other items under the storage levels defined herein. This standard is not intended to address built-in failure mechanisms (e.g., tin whiskers, plating diffusion, and intermetallics) that would take place regardless of storage conditions

The TechAmerica Standards & Technology department is responsible for standardization activities, and provides other appropriate technical and engineering services within the scope of TechAmerica by-laws. Standardization activities shall include those associated with Business, Engineering, and Operations Management and Processes. All activities shall be conducted in accordance with appropriate legal guidance.

This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. It is intended to communicate requirements for a Pb-free Control Plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan Owners in the development of their own Plans. The Plan documents the Plan Owner’s processes that assure their customers, and all other stakeholders that the Plan Owner’s products will continue to meet their requirements, given the risks stated in the Introduction. This standard does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that must be addressed by the processes.

This document defines: (1) A default method for those companies that require a pre-defined approach and (2) A protocol for those companies that wish to develop their own test methods.

The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs which, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Pb-free solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment.

This document defines: 1 A default method for those companies that require a pre-defined approach and 2 A protocol for those companies that wish to develop their own test methods. The default method (Section 4 of the document) is intended for use by electronic equipment manufacturers, repair facilities, or programs which, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Pb-free solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment.

This handbook is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance. Programs may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board finish, or assembly solder) if careful coordination between buyer and supplier is not exercised. For example, piece part manufacturers may not always change part numbers to identify Pb-free finishes, especially if the previous tin-lead (Sn/Pb)-finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection while crucial, may not be sufficient to identify Pb-free piece parts. Note: Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations.

This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, “Performance Standard for Aerospace and High Performance Electronic Systems Containing Pb-free Solder”. Please note that the program manager, and managers of systems engineering, Supply Chain and Quality Assurance (along with their respective organizations), and the appropriate enterprise authority need to work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein “program management (or manager), supplier chain management (or manager), quality assurance management (or manager) and systems engineering management (or manager) and/or the appropriate enterprise authority” shall be defined as “responsible manager” throughout the remaining document (see Section 3, Terms and Definitions).

This Bulletin provides a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware. It is not a mandate nor does it contain any requirements. A tin whisker is a single crystal that emerges from tin-finished surfaces. Tin whiskers can pose a serious reliability risk to electronic assemblies that have pure tin finish. The general risks fall into several categories: [1, 2, 3, 8, 16] Short Circuits: The whisker can create a short circuit, either by 1) growing from an area at one potential to an area at another or 2) breaking free and later bridging these areas. In some cases, these shorts may be permanent and cause catastrophic system failures. A transient short may result if the available current exceeds the fusing current of the whisker, and the whisker can fuse open.

This Handbook provides “how to” guidance to industry and government for the reliability Activities and Methods contained in GEIASTD0009 for developing reliable products and systems, successfully demonstrating them during test and evaluation, and sustaining them throughout the system/product life cycle. GEIASTD0009 requires the developers and customer/users working as a team to plan and implement a reliability program that provides systems/products that satisfy the user’s requirements and expectations using a systems engineering approach. The four Objectives of GEIASTD0009 are listed below: Objective 1: Understand customer/user requirements and constraints. The team (developer, customer, and user) includes the Activities necessary to ensure that the user’s requirements and product needs are fully understood and defined, so that a comprehensive design specification and Reliability program plan are generated. Objective 2: Design and redesign for reliability.

This standard requires the developers and customer/user’s working as a team to plan and implement a reliability program that provides systems/products that satisfy the user’s requirements and expectations. The user’s requirements and needs are expressed in the form of the following four reliability objectives: The developer shall solicit, investigate, analyze, understand and agree to the user’s requirements and product needs. The developer, working with the customer and user, shall include the activities necessary to ensure that the user’s requirements and product needs are fully understood and defined, so that a comprehensive design specification and Reliability Program Plan can be generated. The developer shall use well-defined reliability- and systems-engineering processes to develop, design, and verify that the system/product meets the user’s documented reliability requirements and needs.