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Technical Paper

Analytical Model for Calibration Results Performances Enhancement, Resulting in Automated Prescription for Equipments

2019-09-16
2019-01-1878
The current aeronautical manufacturing sector is characterized by the high level of competence and the required requirement in its production processes, based on the objectives of profitability and safety (airworthiness). In recent years, there is a real revolution in the sector, where the most advanced tools for the organization and optimization of production are given priority, supported by the latest massively used techniques of automatic data collection. , their organized storage and their analytical classification. Metrology plays a key role in ensuring the quality and reliability of the information generated in these productive cycles. The provision of an analytical model of flexible measurement systems, capable and easily adaptable to the dynamics of the company, is presented as one of the pillars in which this new conception of production is based.
Technical Paper

Development of a High Temperature Power Module Technology with SiC Devices for High Density Power Electronics

2011-10-18
2011-01-2620
This paper presents the development of a high density packaging technology for wide band gap power devices, such as silicon carbide (SiC). These devices are interesting candidates for the next aircraft power electronic converters. Effectively they achieve high switching frequencies thanks to the low losses level. High switching frequencies lead to reduce the passive components size and to an overall weight reduction of power converters. Moreover, SiC devices may enable operation at junction temperatures around 250°C. The cooling requirement is much less stringent than for usual Si devices. This might considerably simplify the cooling system, and reduce the overall weight. To achieve the integration requirements for SiC devices, classical wire bonding interconnection is replaced by a stacked packaging using bump interconnection technologies, called sandwich. These technologies offer two thermal paths to drain heat out and present more power integration possibilities.
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