Refine Your Search

Search Results

Viewing 1 to 2 of 2
Technical Paper

Mathematical Model of Water Contamination in Aircraft Fuel Tanks

2011-10-18
2011-01-2540
Water is a contaminant that can lead to fuel system icing, microbial contamination, corrosion and fuel quantity gauging problems and therefore an efficient water management system is required in order to maximise the performance of an aircraft's fuel system. This paper describes a time-transient aircraft fuel tank model with water contamination, due to the principal mechanisms of dissolution, suspension, condensation and transportation. The tank model presented is a component of the NEPTUNE fuel system model which was developed for Airbus using the A380 as an example aircraft. A description of the physics of water contaminated fuel is given and of how this has been incorporated into a mathematical model of an aircraft fuel tank. A modular approach is demonstrated which enables interconnecting fuel tanks to be configured in larger systems in a flexible and easily understood manner.
Technical Paper

Development of a High Temperature Power Module Technology with SiC Devices for High Density Power Electronics

2011-10-18
2011-01-2620
This paper presents the development of a high density packaging technology for wide band gap power devices, such as silicon carbide (SiC). These devices are interesting candidates for the next aircraft power electronic converters. Effectively they achieve high switching frequencies thanks to the low losses level. High switching frequencies lead to reduce the passive components size and to an overall weight reduction of power converters. Moreover, SiC devices may enable operation at junction temperatures around 250°C. The cooling requirement is much less stringent than for usual Si devices. This might considerably simplify the cooling system, and reduce the overall weight. To achieve the integration requirements for SiC devices, classical wire bonding interconnection is replaced by a stacked packaging using bump interconnection technologies, called sandwich. These technologies offer two thermal paths to drain heat out and present more power integration possibilities.
X