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Journal Article

Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module

2017-03-28
2017-01-0011
Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.
Technical Paper

Thermal Electric Analysis of Bond Wires Used in Automotive Electronic Modules

2015-04-14
2015-01-0195
Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.
Technical Paper

Development of an Analytical Tool for Multilayer Stack Assemblies

2011-10-06
2011-28-0083
The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.
Technical Paper

Application of Lean Manufacturing to React to Fast Market Growth

2008-10-07
2008-36-0399
Brazilian automotive market has been growing faster than ever. In order to react properly to market increasing demand in terms of volume and diversity, production systems have to be carefully designed. Traditional manufacturing tends to react to demand increase by outsourcing or investing in new equipments or facilities. Lean thinking suggests that by reducing waste along the value stream it is possible to increase flexibility and freed resources to reduce the investment level required to cope customer’s needs. This paper presents two cases of a system redesign based on the lean manufacturing principles to support the demand.
Technical Paper

Using the Six Sigma Methodology for Process Variation Reduction

2007-11-28
2007-01-2872
This paper is about the use of the Six Sigma Methodology, to solve variation problems in the manufacture area, at one of the Delphi Automotive Systems unit that manufacturer electrical harness. The DMAIC framework was followed, the improvements were done, eliminating the rots causes, and the use of Six Sigma methodology, was showed very efficient in solve problems. The methodology power, is in using a structured frame work, the DMAIC (Define-Measure-Analyze-Improve-Control), completing by quality quality tools (Pareto Chart, Five Why's, Cause and Effect Diagram) and statistical analyses, for example: variance analyses, hypotheses tests and Design of Experiments.
Technical Paper

The New Wireless Frontier: Home and Vehicle Connectivity

2004-10-18
2004-21-0068
Our customers expect in their vehicles the same constant connectivity that they experience in their homes through high speed internet portals. New services based on these advances will be transparent and ubiquitous - completely integrated into our lives, just as electricity comes to the wall socket or water from the faucet. The Wi-Fi Radio implements this vision using Wireless Fidelity (Wi-Fi) based on the suite of IEEE 802.11 standards. Drivers have constant wireless connectivity and personalized digital content made available to them through the Wi-Fi Radio. Ford and our partner Delphi developed the Wi-Fi Radio to overcome the inherent functional and packaging limitations of our vehicles, to quickly introduce new technology at affordable prices and to seamlessly integrate new services into the vehicle. We chose the radio as the integration site because the radio is accessible to every customer and affordable on every vehicle.
Technical Paper

Diagnostic Strategies for Advanced Automotive Systems

2002-10-21
2002-21-0024
In recent years, the desire for improved vehicle performance, reliability and safety have increased the electrical content and its complexity in vehicles. Advanced automotive systems integrate sensors, controllers, actuators and communication networks. To maintain safety and reliability, a comprehensive system of diagnostics and physical and analytic redundancy are used. In some cases, diagnostic strategies based on analytical redundancy can provide detection, as well as fault-tolerance, and may provide benefits in cost, packaging, flexibility and reusability. This paper discusses a range of diagnostic methods and their applicability to advanced automotive systems such as X-by-Wire. It will also show the reduction to practice of an advanced analytical technique for an automotive application.
Technical Paper

Diagnostic Development for an Electric Power Steering System

2000-03-06
2000-01-0819
Electric power steering (EPS) is an advanced steering system that uses an electric motor to provide steering assist. Being a new technology it lacks the extensive operational history of conventional steering systems. Also conventional systems cannot be used to command an output independent of the driver input. In contrast EPS, by means of an electric motor, could be used to do so. As a result EPS systems may have additional failure modes, which need to be studied. In this paper we will consider the requirements for successful EPS operation. The steps required to develop diagnostics based on the requirements are also discussed. The results of this paper have been implemented in various EPS-based programs.
Technical Paper

Multi-Sensor Modules with Data Bus Communication Capability

1999-03-01
1999-01-1277
Automotive multi-sensor modules, capable of vehicle-wide communications via a data bus will be discussed. Proper sensor grouping, packaging and device placement are key issues in the implementation of smart sensor modules. Sensors that are candidates for clustering include temperature, acceleration, angular rate, barometric pressure, chemical, and light sensors. The capability to accommodate a variety of data bus communication protocols is required to satisfy the majority of automotive systems. System integration must be considered when employing a smart sensor network through-out an automobile in a cost effective manner. This paper will cover the module issues associated with sensing, packaging, electronics, communication and system integration.
Technical Paper

Concept to Production: Continuous Surface Keypad Switch

1999-03-01
1999-01-0413
The objective of this paper is to impart the challenges presented and the solutions derived to transform an artist's rendering into a production driver's door switch to be used in the interior of a high profile sports car. The challenges took many forms throughout the process, from data translation and packaging, to the final decorative issues. The results are a finished product providing a new approach to automotive interior switch design. It incorporates a low profile, continuous plane keypad with “soft touch” feel, tactile feedback, and integrated back lighting.
Technical Paper

Rapid Algorithm Development Tools Applied to Engine Management Systems

1998-02-23
980799
Intense competition in the automotive industry requires continuous reduction in innovation cycle time, even as corporations are downsizing and system complexity is increasing. Subsequently, the application of recently introduced Rapid Algorithm Development (RAD) tools has facilitated significant advances in the development of embedded control systems. The RAD steps include system modeling, control algorithm design, simulation analysis, automated calibration design, and vehicle implementation through automatic code generation. The application of RAD tools and the associated benefits are described, specifically in the context of Engine Management Systems (EMS). Such benefits include significant reductions in development cycle time, open architecture, automated calibration, and information reuse.
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