Failure Prediction & Mitigation of Electronic Component in Automotive Controller during Transient Dynamic Event
Today’s automobiles include more electronics features and functions than at any time in history. From engine controller to crash sensing and passenger protection, all the way to automated driving, a complex network of electronic sensors and controls is being integrated into most of the vehicles. While many of these are necessary for increased comfort, convenience and safety, they must also be designed for the stringent quality requirements compared to standard consumer electronics. The business driven need for miniaturization with increased functionality but at reduced cost necessitates use of high density interconnection with advanced electronics components like Ball Grid Array (BGA) instead of many chip scale packages, which are potentially susceptible to failure while handling and shipping of the components. With the reduced mass of the component, accidental drop from the hand level would experience higher impact loading on the component to create significant damage.