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The continuously increasing integration level and resultant “system-on-silicon” and customization trends in VLSI technology will have a significant impact on future automotive electronics. The microcomputer, which is the kernel semiconductor device in automotive electronics, reflects the tremds decribed above. As the VLSI integration level increases, reliability or quality issues will become more and more important, because of the increased impact of a possible device failure. This is particularly so in VLSIs for automotive electronics. In this paper, VLSI technology trends and ways for meeting reliability or quality goals will be reviewed. Also it outlines a future look at automotive electronics in the 21st century, based on a system-on-silicon microcomputer chip, in which several processor units with different functions are integrated together by ULSI technology, where more than ten million device elements are integrated within a single silicon chip with low submicron feature size.

This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.

This paper discusses the latest progress in the development of Fluorescent Indicator Panels from a system interface point of view. Improvements in packaging and mounting, electronic control circuit interfaces, and multicolor displays are described and illustrated. THE FLUORESCENT INDICATOR PANEL (FIP®) is widely used in automotive electronic displays because of its eye-pleasing colors and easy readability and its flexibility in graphics design. The increasing usage has resulted in mechanical improvement to more effectively utilize the space available, electrical improvement for microprocessor control, and optical improvement for multicolor capability.

This paper describes the latest progress in the graphic and package design of Fluorescent Indicator Panels (FIPs). In the expanding application of FIPs in the automotive environment, FIPs cover very wide usages such as gauges for speedo, oil/temp, and tacho and conveniences such as radio, trip-computer, etc. The graphic or pattern design freedom and packaging design flexibility are key factors in offering more sophisticated and attractive FIP displays for automotive systems.

New semiconductor chips have been developed that will allow radio designers to reduce the chip count and gain performance advantages. One chip, the uPD1713G, contains a four bit CMOS microprocessor controller, prescaler, PLL, IF counters, I/O capability and direct AM and FM input. The uPC1296G contains an RF amplifier, mixer, oscillator, IF amplifier, AGC circuitry and signal meter output. These chips can be combined to make a three chip, digitally tuned AM car radio.