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For the prediction of the transient behavior of thermal nodes which are interacting within a Thermal Mathematical Model (TMM) it is necessary to know the heat capacity of each node. For instance this is actual for components of opto-electronic devices for space exploration. Other assignment is to define the thermal properties of new structure materials and their combinations. Often the base for the correction of the TMM is the comparison of the calculated node temperatures with the node temperatures measured on a Thermal Engineering Model (TEM) during a Thermal Vacuum Test. The TEM has to be very similar to the flight hardware from the thermal point of view. But very expensive flight components are replaced in the TEM by thermal equivalent dummies. This makes it possible to use all components of the TEM for an unusual but simple experimental determination of their heat capacity as well.