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Technical Paper

Warpage Prediction on Injection Molded Semi-Crystalline Thermoplastics

2018-04-03
2018-01-0149
Warpage is the distortion induced by inhomogeneous shrinkage during injection molding of plastic parts. Uncontrolled warpage will result in dimensional instability and bring a lot of challenges to the mold design and part assembly. Current commercial simulation software for injection molding cannot provide consistently accurate warpage prediction, especially for semi-crystalline thermoplastics. In this study, the root cause of inconsistency in warpage prediction has been investigated by using injection molded polypropylene plaques with a wide range of process conditions. The warpage of injection molded plaques are measured and compared to the numerical predictions from Moldex3D. The study shows that with considering cooling rate effect on crystallization kinetics and using of the improved material model for residual stress calculations, good agreements are obtained between experiment and simulation results.
Technical Paper

A Comparative Study of Two RVE Modelling Methods for Chopped Carbon Fiber SMC

2017-03-28
2017-01-0224
To advance vehicle lightweighting, chopped carbon fiber sheet molding compound (SMC) is identified as a promising material to replace metals. However, there are no effective tools and methods to predict the mechanical property of the chopped carbon fiber SMC due to the high complexity in microstructure features and the anisotropic properties. In this paper, a Representative Volume Element (RVE) approach is used to model the SMC microstructure. Two modeling methods, the Voronoi diagram-based method and the chip packing method, are developed to populate the RVE. The elastic moduli of the RVE are calculated and the two methods are compared with experimental tensile test conduct using Digital Image Correlation (DIC). Furthermore, the advantages and shortcomings of these two methods are discussed in terms of the required input information and the convenience of use in the integrated processing-microstructure-property analysis.
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