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This document should be used as guidance for non-handbook based reliability predictions conducted on automotive electronics products. It presents a method that utilizes warranty and field repair data to calculate the failure rates of individual electronic components and predict the reliability of the entire electronic system. It assumes that the user has access to a database containing field return data with classification of components, times to failure, and a total number of components operating in the field.

This document will primarily address intrinsic reliability of electronic components for use in automotive electronics. Where practical, methods of extrinsic reliability detection and prevention will also be addressed. The current handbook primarily focuses on integrated circuit subjects, but can easily be adapted for use in discrete or passive device qualification with the generation of a list of failure mechanisms relevant to those components. Semiconductor device qualification is the main scope of the current handbook. Other procedures addressing extrinsic defects are particularly mentioned in the monitoring chapter. Striving for the target of Zero Defects in component manufacturing and product use it is strongly recommended to apply this handbook. If it gets adopted as a standard, the term “shall” will represent a binding requirement. This document does not relieve the supplier of the responsibility to assure that a product meets the complete set of its requirements.

This recommended practice has been developed for use in any EEE system used in the AADHP industries. RPA is especially important to AADHP systems, which are often safety critical applications that must operate for long times in rugged environments. These EEE systems often use EEE components that were originally designed and produced for more benign consumer applications. Although the focus of this recommended practice is on AADHP applications, the process described herein is not limited to AADHP and may be used for EEE systems and components in any industry.

This glossary has been compiled to assist, by serving as a reference, in the communication between the automotive electronics engineer and the reliability engineer. The compilation of terms, acronyms and symbols was drawn from usage which should be familiar to those working in automotive electronics reliability. Terms are included which are used to describe how items, materials and systems are evaluated for reliability, how they fail, how failures are modeled and how failures are prevented. Terms are also included from the disciplines of designing for reliability, testing, and failure analysis as well as the general disciplines of Quality and Reliability Engineering. This glossary is intended to augment SAE J1213, Glossary of Automotive Electronic Terms.

This document addresses robustness of electrical/electronic modules for use in automotive applications. Where practical, methods of extrinsic reliability detection and prevention will also be addressed. This document primarily deals with electrical/electronic modules (EEMs), but can easily be adapted for use on mechatronics, sensors, actuators and switches. EEM qualification is the main scope of this document. Other procedures addressing random failures are specifically addressed in the CPI (Component Process Interaction) section 10. This document is to be used within the context of the Zero Defect concept for component manufacturing and product use. It is recommended that the robustness of semiconductor devices and other components used in the EEM be assured using SAE J1879 OCT2007, Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications.

This document addresses robustness of electrical/electronic modules for use in automotive applications. Where practical, methods of extrinsic reliability detection and prevention will also be addressed. This document primarily deals with electrical/electronic modules (EEMs), but can easily be adapted for use on mechatronics, sensors, actuators and switches. EEM qualification is the main scope of this document. Other procedures addressing random failures are specifically addressed in the CPI (Component Process Interaction) section 10. This document is to be used within the context of the Zero Defect concept for component manufacturing and product use. It is recommended that the robustness of semiconductor devices and other components used in the EEM be assured using SAE J1879 OCT2007, Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications.

This compilation of terms, acronyms and symbols was drawn from usage which should be familiar to those working in automotive electronics reliability. Terms are included which are used to describe how items, materials and systems are evaluated for reliability, how they fail, how failures are modeled and how failures are prevented. Terms are also included from the disciplines of designing for reliability, testing and failure analysis as well as the general disciplines of Quality and Reliability Engineering. This glossary is intended to augment SAE J1213, Glossary of Automotive Electronic Terms.

This document establishes the general environmental, mechanical and quality requirements pertaining to IC's. It also describes the qualification and production acceptance procedures performed by the supplier. It is to be used as a guideline which device buyers can apply wholly or in part as appropriate for their needs and applications. This document is essentially part number independent. The detail specification particular to a device part number will be given separately, containing all detailed electrical and mechanical parameters.