Thermal Behavior of an Electronics Compartment with Respect to Real Driving Conditions
The reliability of electronic components is of increasing importance for further progress towards automated driving. Thermal aging processes such as electromigration is one factor that can negatively affect the reliability of electronics. The resulting failures depend on the thermal load of the components within the vehicle lifetime - called temperature collective - which is described by the temperature frequency distribution of the components. At present, endurance testing data are used to examine the temperature collective for electronic components in the late development stage. The use of numerical simulation tools within Vehicle Thermal Management (VTM) enables lifetime thermal prediction in the early development stage, but also represents challenges for the current VTM processes [1, 2]. Due to the changing focus from the underhood to numerous electronic compartments in vehicles, the number of simulation models has steadily increased.