Refine Your Search

Date

Date

Topic

Topic

AMS P17 Polymer Matrix Composites Committee Fuels and Energy Sources Gases Biofuels

Search Results

Viewing 1 to 17 of 17
1
Sort by published
Standard

Adhesive, Film Form Metallic Structural Sandwich Construction
2022-10-04
CURRENT
AMSA25463
This specification covers the requirements for adhesives in film form for bonding metal facings to metal cores and to metal components of sandwich panels which are intended for use in primary and secondary structural airframe parts that may be exposed to temperatures up to 500°F (260°C).
Standard

Application of Direct Pressure to Resin in Curing of Epoxy and Addition Type Polyimides
2022-06-07
CURRENT
ARP1927
This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.
Standard

Automated Manufacture of Continuous Multi-Ply Carbon Fiber/Epoxy Resin Impregnated Broadgoods
2022-06-05
CURRENT
ARP1674A
This document describes a manufacturing method for processing unidirectional carbon fiber/epoxy resin impregnated sheet and tape into multi-ply broadgoods and tape produced on an automated cross-plying machine. Broadgoods or tape of two or more ply configurations may be processed, where ply orientations of 0°, 45°, 90°, and 135° (as examples) may be automatically layed in a programmed sequence. In all configurations, the 0° ply direction is parallel to the length of the broadgoods roll or sheet, or tape.
Standard

Polyimide Printed Circuit Boards Fabrication of
2022-06-05
CURRENT
ARP1612A
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Standard

Physical-Chemical Characterization Techniques, Epoxy Adhesive and Prepreg Resin Systems
2022-06-05
CURRENT
ARP1610A
This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.
1
X