Reliability Assurance of Photonic Integrated Circuit (PIC) Based Devices Used in Aerospace Applications
This document is intended to provide reliability assurance recommended practices for the deployment of individual photonic devices and PIC-based devices into aerospace platforms, focusing on reliability requirements to reach Technology Readiness Level (TRL) 7, 8 and 9. It will cover reliability assurance tests for single element and PIC chips, packaged single element and PIC chips and some single element and PIC based higher functionality modules, such as fiber-optic transmitters and receivers, free space optical transmitters and receivers, illuminators and sources for optical sensors. The document will provide the reasons and methods for aerospace reliability assurance of PIC chips, PIC based packages and PIC based devices. It will be as inclusive as possible, including PIC chips fabricated in the main material systems: semiconductors (Group IV, III-V, II-VI), electro-optic crystals (lithium niobate) and polymers.