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This technical report identifies the requirements for an LFCP for ADHP soldered electronic products built fully or partially with Pb-free materials and assembly processes. An LFCP documents the specific Pb-free materials and assembly processes used to assure customers their ADHP soldered electronic products will meet the applicable reliability requirements of the customer. This standard specifically addresses LFCPs for: a Pb-free components and mixed assembly: Products originally designed and qualified with SnPb solder and assembly processes that incorporate components with Pb-free termination finishes and/or Pb-free BGAs, i.e., assembling Pb-free parts using eutectic/near-eutectic SnPb processes (also known as mixed metallurgy). b COTS products: COTS products likely built with Pb-free materials and assembly processes. c Pb-free design and assembly: Products designed and qualified with Pb-free solder and assembly processes.

This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, “Performance Standard for Aerospace and High Performance Electronic Systems Containing Pb-free Solder”. Please note that the program manager, and managers of systems engineering, Supply Chain and Quality Assurance (along with their respective organizations), and the appropriate enterprise authority need to work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein “program management (or manager), supplier chain management (or manager), quality assurance management (or manager) and systems engineering management (or manager) and/or the appropriate enterprise authority” shall be defined as “responsible manager” throughout the remaining document (see Section 3, Terms and Definitions).

This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “Rework/Repair” is used as applicable. NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.

This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin finishes in electronic systems. This Standard is applicable to Aerospace, Defense, and High Performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. It is intended to communicate requirements for a Pb-free Control Plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan Owners in the development of their own Plans. The Plan documents the Plan Owner’s processes that assure their customers, and all other stakeholders that the Plan Owner’s products will continue to meet their requirements, given the risks stated in the Introduction. This standard does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that must be addressed by the processes.

This handbook is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance. Programs may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board finish, or assembly solder) if careful coordination between buyer and supplier is not exercised. For example, piece part manufacturers may not always change part numbers to identify Pb-free finishes, especially if the previous tin-lead (Sn/Pb)-finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection while crucial, may not be sufficient to identify Pb-free piece parts. Note: Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations.