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The presentation describes a technical solution for 100 Mbit/s Ethernet Data transmission cabling. This solution considers the specific requirements of automotive wiring harness and manufacturing. It bases on standard automotive connectors and headers. Currently the development of automotive electronic architecture considers central ECU or data backbone structure for the upcoming EE architecture (e. g. single ECU for network; SEN). For these structures solid and cost effective data backbone solutions are essential. Ethernet, a wide distributed and well-known bus system for office and industry data distribution provide a wide range of software tools and many physical layer solutions. Several cabling systems are available. Based on this we propose a solution for automotive application.

Power electronics products such as inverters and converters involve the use of Thermal Interface Materials (TIMs) between high power packages and a heat exchanger for thermal management. Conventional TIMs such as thermal greases, gels, solders and phase change materials (PCMs) face challenges to meet the need of these products to operate reliably at much higher temperatures. This has driven the development of new TIMs such as Transient Liquid Phase Sintering (TLPS) Conductive Adhesives. TLPS adhesives have been developed for many potential applications due to various advantages like lead free, flux-less and particularly their low temperature processability, which enables the use of heat sensitive components in the design. With all these motivations, a project was launched and completed to assess TLPS adhesives as a unique TIM for high temperature automotive applications due to its high bulk thermal conductivity and metallic joint formation at interfaces.

A majority of the plastics manufacturing operations are dependent on the formability of the molten thermoplastics. Ability of the material to flow at a set temperature influences the formability and the overall polymer melt process. Lubricating additive technologies are being developed to engineer the melt flow performance of the resin, promoting the compounding and molding process such as to reduce torque on the motor, reduced shear degradations, enhance uniform filling of hard-to-fill section, promoting thin wall molding, and influence the overall cycle time. Various lubricants are used in formulations to supplement superior flow and metal release with minimal effect on mechanical properties. This paper discusses the methodology to characterize the effectiveness of melt flow additives through comparing two different processing aids in Polybutylene terephthalate (PBT) polyester filled and unfilled matrix and imply differences in processing.

During the evolution of Hybrid vehicles as well as electrical vehicles the need for an additional Voltage level was defined for the utilization of high power loads like electrical compressors, electrical heaters as well as power steering and electrical pumps. The main systems benefit is the generation of approximately 12 kW electrical power by a traditional belt driven Generator. This allows boost function for acceleration and recuperation for mild hybrid vehicles with the target to reduce up to 15% CO2 by keeping the traditional thermal based engines. Delphi has developed systems and components that meet the special 48 Volt related electrical requirements on arcing, hot plugging and corrosion. Our benefit is the long term expertise within the total system know how and the derived technical specification and needs.

There is a continual growth of test and validation in high reliability product applications such as automotive, military and avionics. Principally this is driven by the increased use and complexity of electronic systems deployed in vehicles, in addition to end user reliability expectations. Higher reliability expectations consequently driving increased test durations. Furthermore product development cycles continue to reduce, resulting in less available time to perform accelerated life tests. The challenge for automotive electronic suppliers is performing life tests in a shorter period of time whilst reducing the overall associated costs of validation testing. In this paper, the application of prognostic and health monitoring techniques are examined and a novel approach to the validation and testing of automotive electronics proposed which it is suggested may be more cost effective and efficient than traditional testing.

Wide varieties of vehicle Engine Management Systems are designed by different Tier#1 suppliers to meet highly complex requirements with the help of electronics. Emerging technologies and features of Engine Management Systems require a number of strategies for reducing the overall timing for verification with high quality testing. Analysis and decoding of data especially for highly critical and complex such as gasoline direct injection (GDi) engine fuel delivery output, high pressure fuel pump (HPFP), spark control output and different varieties of engine position signals are time consuming. This paper introduces Virtual Engine Control Module (VECM) technology to solve the problem of decoding complex signals and high level verification. A proposed test bench setup consists of VECM, ECM, simulator and real actuator load with complete software flashed inside the ECM.

Automotive Electronic Control Unit (ECU) has semiconductor devices performing various time dependent functions. It is essential to understand the transient thermal behavior of these devices for designing a reliable system. Detailed thermal model (DTM) is the need of the hour to understand the characteristics by performing a transient system level simulation. The information to build DTM is not readily available in the public domain due to intellectual property protection from the device suppliers. To overcome this, the present work showcases the procedure to develop Transient Thermal Network Model (TTNM) using resistance and capacitance values extracted from the impedance curve provided by the semiconductor manufacturer. TTNM model is developed for a typical DPAK and D2PAK device and validated by comparing impedance curve derived from simulation with datasheet.