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Our customers expect in their vehicles the same constant connectivity that they experience in their homes through high speed internet portals. New services based on these advances will be transparent and ubiquitous - completely integrated into our lives, just as electricity comes to the wall socket or water from the faucet. The Wi-Fi Radio implements this vision using Wireless Fidelity (Wi-Fi) based on the suite of IEEE 802.11 standards. Drivers have constant wireless connectivity and personalized digital content made available to them through the Wi-Fi Radio. Ford and our partner Delphi developed the Wi-Fi Radio to overcome the inherent functional and packaging limitations of our vehicles, to quickly introduce new technology at affordable prices and to seamlessly integrate new services into the vehicle. We chose the radio as the integration site because the radio is accessible to every customer and affordable on every vehicle.

Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.