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This paper is about the use of the Six Sigma Methodology, to solve variation problems in the manufacture area, at one of the Delphi Automotive Systems unit that manufacturer electrical harness. The DMAIC framework was followed, the improvements were done, eliminating the rots causes, and the use of Six Sigma methodology, was showed very efficient in solve problems. The methodology power, is in using a structured frame work, the DMAIC (Define-Measure-Analyze-Improve-Control), completing by quality quality tools (Pareto Chart, Five Why's, Cause and Effect Diagram) and statistical analyses, for example: variance analyses, hypotheses tests and Design of Experiments.

Intense competition in the automotive industry requires continuous reduction in innovation cycle time, even as corporations are downsizing and system complexity is increasing. Subsequently, the application of recently introduced Rapid Algorithm Development (RAD) tools has facilitated significant advances in the development of embedded control systems. The RAD steps include system modeling, control algorithm design, simulation analysis, automated calibration design, and vehicle implementation through automatic code generation. The application of RAD tools and the associated benefits are described, specifically in the context of Engine Management Systems (EMS). Such benefits include significant reductions in development cycle time, open architecture, automated calibration, and information reuse.

Brazilian automotive market has been growing faster than ever. In order to react properly to market increasing demand in terms of volume and diversity, production systems have to be carefully designed. Traditional manufacturing tends to react to demand increase by outsourcing or investing in new equipments or facilities. Lean thinking suggests that by reducing waste along the value stream it is possible to increase flexibility and freed resources to reduce the investment level required to cope customer’s needs. This paper presents two cases of a system redesign based on the lean manufacturing principles to support the demand.

The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.

Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.