Search Results

Spot, or distributed, cooling and heating is an energy efficient way of delivering comfort to an occupant in the car. This paper describes an approach to distributed cooling in the vehicle. A two passenger CFD model of an SUV cabin was developed to obtain the solar and convective thermal loads on the vehicle, characterize the interior thermal environment and accurately evaluate the fluid-thermal environment around the occupants. The present paper focuses on the design and CFD analysis of the energy efficient HVAC system with spot cooling. The CFD model was validated with wind tunnel data for its overall accuracy. A baseline system with conventional HVAC air was first analyzed at mid and high ambient conditions. The airflow and cooling delivered to the driver and the passenger was calculated. Subsequently, spot cooling was analyzed in conjunction with a much lower conventional HVAC airflow.

This paper describes the development and implementation of an Engine Drag Control algorithm to improve vehicle stability performance. Engine drag can occur on low and high coefficient surfaces when the driver suddenly releases the throttle. If the engine drag force becomes larger than the frictional force between the tire and the road, the tires will break loose from the surface and slip. This could induce vehicle instability especially with rear drive vehicles on low-coefficient surfaces. The EDC algorithm has been developed to provide accurate control of the wheels. EDC will help reduce the yaw rate of the vehicle and thus achieve greater vehicle stability. The paper also presents methods used to test the robustness of such a system. The purpose of the testing was to ensure that there would be no false activations of EDC under normal driving conditions and also to ensure that, when the system is active, it is mostly transparent to the driver.

Delphi Automotive Systems and BMW are jointly developing Solid Oxide Fuel Cell (SOFC) technology for application in the transportation industry primarily as an on-board Auxiliary Power Unit (APU). In the first application of this joint program, the APU will be used to power an electric air conditioning system without the need for operating the vehicle engine. The SOFC based APU technology has the potential to provide a paradigm shift in the supply of electric power for passenger cars. Furthermore, by supplementing the conventional fuel with reformate in the internal combustion engine, extremely low emissions and high system efficiencies are possible. This is consistent with the increasing power demands in automobiles in the new era of more comfort and safety along with environmental friendliness. Delphi Automotive Systems and BMW were successful in demonstrating an Auxiliary Power Unit (APU) based on Solid Oxide Fuel Cell (SOFC) technology in February, 2001.

A parametric study on the effects of critical injector design parameters of inwardly-opening pressure-swirl injectors was carried out using 3-D internal flow simulations. The pressure variation and the integrated momentum flux across the injector, as well as the flow distributions and turbulence structure at the nozzle exit were analyzed. The critical flow effects on the injector design identified are the swirler efficiency, discharge coefficient, and turbulence breakup effects on the spray structure. The study shows that as a unique class of injectors, pressure-swirl injectors is complicated in fluid mechanics and not sufficiently characterized or optimized. The swirler efficiency is characterized in terms of the trade-off relationship between the swirl-to-axial momentum-flux ratio and pressure drop across the swirler. The results show that swirl number is inversely proportional to discharge coefficient, and that hole diameter and swirler height is the most dominant parameters.

A single-crystal silicon capacitive acceleration sensor for low-g applications has been developed. The sensor element itself is formed entirely from single crystal silicon, giving it exceptional stability over time and temperature and excellent shock resistance. The sensor is produced using low-cost, high volume processing, test and calibration. The sensor integrated circuit (IC) contains a proofmass which moves in response to applied accelerations. The position of the proofmass is capacitively detected and processed by an interface IC. The sensor/interface IC system is packaged in a small outline IC (SOIC) package for printed circuit board mounting. The module is designed to measure full scale accelerations in the 0.75g to 3g range to suit a variety of automotive, industrial and consumer applications

Delphi's Zero Resistance Technology (ZRT) is a revolutionary new product/process that enables the reduction of mass and volume from a traditional wiring assembly. ZRT is defined as a minimal (zero) resistance change over time. The ZRT product is an electrical/electronic connection system which provides a viable solution for high density and limited space wiring applications. The ZRT process is a semi-automated wiring harness manufacturing system with flexibility to produce harnesses to the customer demand.

Miniaturization is an important trend in many technology segments, once it can enable innovative applications generating new markets. This trend was begun in electronics industry after World War II and has spawned changes into automotive sector also. For Automotive Wiring Harness, miniaturization is clearly presented in most of the components, mainly because of its benefits like the potential of mass reduction, cost reduction and efficiency improvement. Furthermore the main voice of customer points to cable gauge reduction that represents a considerable challenge for connection manufacturing process due to quality control limitations presented by conventional crimp process for 0,35 [mm₂] cables and smaller. According to that, the scope of this article is to present, in details, a manufacturing process optimization for an alternative and more robust technology of joining copper stranded cables to tin brass terminals used on automotive wiring harness, Resistance Welding.

Optimization of the mechanical aspects of a heated conical oxygen sensor for desired performances, such as low heater power, good poison resistance, fast light-off, and broad temperature range, etc. was achieved with computer modeling. CFD analysis was used to model the flow field in and around a sensor in an exhaust pipe to predict the convection coefficients, poisoning, and switching time. Heat transfer analysis coupled with electrical heating was applied to predict temperature and light-off time. Results of the optimization are illustrated, with good agreements between modeling and testing.

Tomorrow's winning powertrain solutions reside in those technology combinations providing optimized propulsion systems with zero emissions and no cost or performance penalty compared with today's vehicles. The recent Kyoto Protocol for CO2 reduction and the California Air Resources Board (CARB) thrust for zero emission vehicles along with the European Regulatory community, motivate car manufacturers to adopt new light body structures with low aerodynamic drag coefficients, low-rolling resistance and the highest efficiency powertrains. The environmental equation expresses car manufacturers aptitude and desire to create zero emission vehicles at acceptable levels of performance unlike limited range electrical powered vehicle products. The cheapest solution to the environmental equation remains the conventional internal combustion engine ($30 to $50 per kW).

Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.