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Technical Paper

LIN Bus and its Potential for Use in Distributed Multiplex Applications

2001-03-05
2001-01-0072
The increasing features and complexity of today's automotive architectures are becoming increasingly difficult to manage. Each new innovation typically requires additional mechanical actuators and associated electrical controllers. The sheer number of black boxes and wiring are being limited not by features or cost but by the inability to physically assemble them into a vehicle. A new architecture is required which will support the ability to add new features but also enable the Vehicle Assembly Plants to easily assemble and test each subsystem. One such architecture is a distributed multiplex arrangement that reduces the number of wires while enabling flexibility and expandability. Previous versions have had to deal with issues such as noise immunity at high switching currents. The LIN Bus with its low cost and rail-to-rail capability may be the key enabling technology to make the multiplexed architecture a reality.
Technical Paper

Automotive Miniaturization Trend: Challenges for Wiring Harness Manufacturing

2010-10-06
2010-36-0160
One of the most evident trends in automotive sector is miniaturization. It is related to considerable benefits due to the potential of mass reduction, cost reduction and efficiency improvement. It involves many different automobile components and most of them are facing challenges to achieve the targets defined by car makers and final consumers. Specifically for wiring harness, it seems to be many manufacturing and process challenges to be surpassed in order to fully perceive the benefits expected with miniaturization, internally and externally. So this article aims to present an overview of literature as well as reporting of experts on this issue mentioning some of the challenges that global automotive wiring harness manufacturers are facing. Subjects as assembly automation, terminal connection and small gauge cables are discussed in the article and also a general overview of how those problems are being addressed in order to meet customer requirements.
Technical Paper

Development of an Analytical Tool for Multilayer Stack Assemblies

2011-10-06
2011-28-0083
The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.
Technical Paper

Laser Welding: An Exploratory Study towards Continuous Improvement on Stainless Steel Welding Joints

2009-10-06
2009-36-0330
The utilization of Laser welding process has increased during last years in several areas of industry, due to many benefits that can be achieved with this technology, such as: flexibility, productivity and quality. Thus, the optimization of Laser welding processes has been considered as a “green field” to be explored by Laser manufacturers, automation companies and process/project engineers. Nowadays there are few researches that provide a roadmap for Laser welding processes improvement that approaches both the aspects and characteristics applied to evaluate the Laser weld application performance. Therefore, this paper has per its main purpose through an exploratory study to provide parameters toward continuous improvement of Laser welding process considering both types of Lasers: Laser spot weld and Laser seam weld of stainless steel joints, thus this work may be considered as theoretical and practical reference to be applied by people involved with Laser welding applications.
Technical Paper

Resistance Welding for Automotive Wiring Harness Connection - Small Gauge Cables

2012-10-02
2012-36-0153
Miniaturization is an important trend in many technology segments, once it can enable innovative applications generating new markets. This trend was begun in electronics industry after World War II and has spawned changes into automotive sector also. For Automotive Wiring Harness, miniaturization is clearly presented in most of the components, mainly because of its benefits like the potential of mass reduction, cost reduction and efficiency improvement. Furthermore the main voice of customer points to cable gauge reduction that represents a considerable challenge for connection manufacturing process due to quality control limitations presented by conventional crimp process for 0,35 [mm₂] cables and smaller. According to that, the scope of this article is to present, in details, a manufacturing process optimization for an alternative and more robust technology of joining copper stranded cables to tin brass terminals used on automotive wiring harness, Resistance Welding.
Technical Paper

Cavity Fill Balancing Technique for Rubber Injection Molding

2015-04-14
2015-01-0715
Balancing the fill sequence of multiple cavities in a rubber injection mold is desirable for efficient cure rates, optimized cure times, and consistent quality of all molded parts. The reality is that most rubber injection molds do not provide a consistent uniform balanced fill sequence for all the cavities in the mold - even if the runner and cavity layout is geometrically balanced. A new runner design technique, named “The Vanturi Effect”, is disclosed to help address the inherent deficiencies of traditional runner and cavity layouts in order to achieve a more balanced fill sequence. Comparative analysis of molded runner samples reveals a significant and positive improvement in runner and cavity fill balancing when the Vanturi Effect is integrated into the runner design.
Technical Paper

Globalization of the Design for Manufacturability/Assembly Process within the Automotive Wiring Assembly Business

1999-03-01
1999-01-0052
Automotive wiring assembly design and manufacturing has evolved from a locally based business to a global business. It is common today to engineer the design of a wiring assembly in one region of the world, to manufacture it in a second region, and to assemble it into the vehicle in a third region. This creates a need for global collaboration, training and communications. Design for Manufacturability (DFM) is a tool that can aid in this, in developing common processes globally, and reducing the cost and design complexity of the product in the early design stages. To develop a global DFM process, an organization must develop and implement a strategy. This paper will review the approach that an automotive wiring assembly supplier adopted. It will enumerate the benefits of developing a global Design for Manufacturability process, selecting a champion, and using a twelve-step plan to integrate DFM into each region.
Technical Paper

Disc Brake Corner System Modeling and Simulation

1999-10-10
1999-01-3400
This paper documents the advantages of brake corner system modeling and simulation over traditional component analysis techniques. A better understanding of the mechanical dynamics of the disc-braking event has been gained through brake corner system modeling and simulation. Single component analyses do not consider the load transfer between components during the braking event. Brake corner system analysis clearly quantifies the internal load path and load transfer sequence between components due to clearances or tolerance variations in the brake assembly. By modeling the complete brake corner assembly, the interaction between components due to the contact friction loads and variational boundary conditions can be determined. The end result permits optimal design of brake corner systems having less deflection, lower stress, optimum material mass, and reduced lead-time for new designs.
Technical Paper

Non-Linear Dynamic Analysis of a SuperPlug™ Door Module Response to a Door Slam Event

1999-03-01
1999-01-0406
The SuperPlug™ door module is a new Delphi innovation. It is a one-piece composite structure, which integrates several door components into one assembly. This reduces the total part count, simplifies the vehicle level assembly process, and reduces labor cost (see the Appendix). The door slam durability test is an important factor in door module design. As more hardware is integrated into the SuperPlug, this subsystem performance in a door slam test becomes important. Therefore, the correct placement of components and the supporting structure is critical. Currently, the evaluation of door slam durability for the SuperPlug is a process of build then test. This is time consuming and costly due to a long testing lead-time and the expense of tooling a new mold. It was realized that a numerical process for assessing the effect of door slam would be required. This process would compute the dynamic response using finite element analysis (FEA).
Technical Paper

All Olefinic Interiors-What Will It Take To Happen?

2000-03-06
2000-01-0632
TPO is getting wider acceptance for automotive applications. An exterior application like a fascia is a very good example. Interiors are still a challenge due to many reasons including overall system cost. For interior applications, “all-olefin” means it mainly consists of three materials: TPO skin, cross-linked olefinic-based foam and PP substrate. The driving force for TPO in Europe is mainly recyclability while in the USA, it is long-term durability. This paper describes the key limitations of the current TPO systems which are: poor grain retention of TPO skin, shrinkage in-consistency of the skin, high cost of priming (or other treatments) and painting of the skin, lower process window of the semi-crystalline TPO material during thermoforming or In-mold lamination / Low pressure molding, high cost of the foam, low tear strength of the foam for deep draw ratio etc.
Technical Paper

Implementation of Lead-Free Solder for Automotive Electronics

2000-03-06
2000-01-0017
Lead-free solders for electronics have been actively pursued since the early 1990's here and abroad for environmental, legislative, and competitive reasons. The National Center for Manufacturing Sciences (NCMS-US)1, the International Tin Research Institute (ITRI-UK)2, Swedish Institute of Production Engineering Research (IVF-Sweden)3, Japan Institute of Electronics Packaging (JIEP Japan)4, Improved Design Life and Environmentally Aware Manufacture of Electronics Assemblies by Lead-free Soldering (IDEALS-Europe)5, and, more recently, the National Electronics Manufacturing Initiative (NEMI-US)6 have been aggressively seeking lead-free solutions The automotive industry has some unique requirements that demand extensive testing of new materials and processes prior to implementation. The specific steps taken at Delphi Automotive Systems with lead-free solder will be described along with the lessons learned along the way.
Technical Paper

Environmentally Conscious Manufacturing of TPO Instrument Panel Skins

2000-03-06
2000-01-0023
Thermoplastic polyolefin (TPO) instrument panel skins are in demand in Europe and Asia as a solution to final product disposition environmental concerns. In North America TPO is valued for its durability characteristics (particularly heat and UV aging) and capability for deployment of seamless airbags at cold temperatures. Desiring to have an environmentally “green” system to create the “green” product, Delphi designed a manufacturing process with in-plant closed loop recycling of 100% offal directly back into the skin and the use of waterbased coating system for combating concerns with solvents. Delphi's development of recyclable TPO skin for instrument panels was introduced on 1997 production of Mercedes-Benz M-class. The paper will describe how the systems approach was used in overcoming the challenges involved in closed loop recycling of engineered offal during sheet manufacturing and thermoforming processes and the implementation of waterbased primer and topcoat systems.
Technical Paper

System Modeling of A Damper Module

2000-03-06
2000-01-0727
A recent trend within the automotive industry has been an emphasis on the development of modular assemblies for future vehicle applications. This trend has created a need for the development of methods to predict the performance of modules within the vehicle environment. In particular, the development of system models that account for the interactions between components within a modular assembly is necessary to insure that a module is properly designed. This paper describes a finite element system model of a damper module as installed in a McPherson strut front suspension. The modeling techniques used to construct the components within the modular assembly are discussed. The results of a study of the structural behavior of a damper module model subjected to quasi-static loading conditions are presented. Additionally, the effects of changes in individual component specifications on the overall system response are considered and the results are displayed.
Technical Paper

Zero Resistance Technology (ZRT)

2005-11-22
2005-01-4109
Delphi's Zero Resistance Technology (ZRT) is a revolutionary new product/process that enables the reduction of mass and volume from a traditional wiring assembly. ZRT is defined as a minimal (zero) resistance change over time. The ZRT product is an electrical/electronic connection system which provides a viable solution for high density and limited space wiring applications. The ZRT process is a semi-automated wiring harness manufacturing system with flexibility to produce harnesses to the customer demand.
Technical Paper

An Analytical Assessment of Rotor Distortion Attributed to Wheel Assembly

2001-10-28
2001-01-3134
The lateral runout of disc brake corner components can lead to the generation of brake system pulsation. Emphasis on reducing component flatness and lateral runout tolerances are a typical response to address this phenomenon. This paper presents the results of an analytical study that examined the effect that the attachment of the wheel to the brake corner assembly could have on the lateral distortion of the rotor. An analysis procedure was developed to utilize the finite element method and simulate the mechanics of the assembly process. Calculated rotor distortions were compared to laboratory measurements. A statistical approach was utilized, in conjunction with the finite element method, to study a number of wheel and brake corner parameters and identify the characteristics of a robust design.
Technical Paper

Instrument Panel Skin Manufactured with 100% Recycled TPO Material

2002-03-04
2002-01-1262
Desiring to push thermoplastic poly-olefin (TPO) technology to its fullest limits and to confirm our position as the leader in the manufacturing of environmentally friendly TPO instrument panels, we have designed a process to manufacture 100% recycled instrument panel skins. This closed-loop process begins with extruding 100% recycled TPO flake into sheet stock to be painted and vacuum formed. The painted sheet is vacuum formed and the offal is ground into regrind flake, ready to be extruded again, thus completing the closed-loop process. This paper will describe a 100% closed loop recycling process for TPO instrument panels, discuss the intense validation process for recycled material and prove the robustness and durability of this interior solution.
Technical Paper

Environmentally Friendly Car Wiring System

2002-03-04
2002-01-0595
Legal requirements and responsibility for the environment require improved recyclability of car components. This can be achieved by a reduction in the variety of materials used, which can be separated after use. This is being demonstrated for wiring harnesses using a new hook and loop based fastening system. Easier assembly and disassembly, elimination of fixation holes in the car body, and improved serviceability can lead to considerable cost reductions. Field experience on test cars will be available at a later date.
Technical Paper

Six Sigma: Behind The Scenes

2002-11-19
2002-01-3510
Although the Six Sigma [1] concept has become very popular in industrial sectors, very little is said about how to start a successful implementation in a Corporation, or when it should be initiated, and the most important, who should be addressed to lead this task. Its methodologies are widely observed by different sectors of the automotive market, typically focusing in projects with a potential financial impact, following the DMAIC sequence. More than just financial return, this sophisticated tool, has a direct impact on Quality in different levels for both non-productive process and manufacturing process, that eventually would also affect some organizational structures that ultimately can be understood as reengineering.
Journal Article

Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module

2017-03-28
2017-01-0011
Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.
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