Search Results

There are an increasing number of applications for resonant micromachines. Accelerometers, angular rate sensors, voltage controlled oscillators, pressure and chemical sensors have been demonstrated using this technology. Several of these devices are employed in vehicles. Vibrating devices have been made from silicon, quartz, GaAs, nickel and aluminum. Resonant microsystems are in constant motion and so present new challenges in the area of reliability for vehicular applications. The impact of temperature extremes, cyclic fatigue, stiction, thermal and mechanical shock on resonant device performance is covered.

Automotive multi-sensor modules, capable of vehicle-wide communications via a data bus will be discussed. Proper sensor grouping, packaging and device placement are key issues in the implementation of smart sensor modules. Sensors that are candidates for clustering include temperature, acceleration, angular rate, barometric pressure, chemical, and light sensors. The capability to accommodate a variety of data bus communication protocols is required to satisfy the majority of automotive systems. System integration must be considered when employing a smart sensor network through-out an automobile in a cost effective manner. This paper will cover the module issues associated with sensing, packaging, electronics, communication and system integration.