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The paper describes the design and construction of a two cylinder apparatus to measure heat transfer under conditions of oscillating pressure and oscillating flow such as found in Stirling-cycle machines. The apparatus consists of two large single stage air compressors joined by a rigid drive shaft between the two crank shafts. The compressors are 27.94 cm (11-in) diameter by 22.86 cm (9-in) stroke. The apparatus is powered by a 25 HP variable speed DC motor. Belts and a jack shaft provide wide speed ranges. The test section, which is connected between the compressor cylinders, is a 44.45 mm (1.75-in) diameter tube and about 254 cm (100-in) long. The test section is configured for measuring wall heat flux, and gas pressure as a function of time. An LDV system is being installed for measurement of gas velocity as a function of time and position. A fast response micro thermocouple measures gas temperature as a function of time and position.

This paper describes the thermal management and design challenges of testing packaged integrated circuit (IC) devices, specifically device thermal conditioning and device-under-test (DUT) temperature control. The approach taken is to discuss the individual thermal design issues as defined by the device type (e.g. memory, microcontroller) and tester capabilities. The influence of performance-parameter specifications, such as the DUT parallelism, test time, index time, test-temperature range and test-temperature tolerance are examined. An understanding of these performance requirements and design constraints enables consideration of existing test handler thermal processing systems (e.g., gravity feed, pick and place), future test handler thermal concepts, and future high-parallelism testing needs for high-wattage memory and microprocessor devices. New thermal designs in several of these areas are described.