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The thinnest wall thickness of automotive catalyst substrates has previously been 30 μm for metal substrates and 50 μm for ceramic substrates. This paper describes a newly developed catalyst substrate that is the world's first to achieve 20-μm-thick cell walls. This catalyst substrate features low thermal capacity and low pressure loss. Generally, a thinner cell wall decreases substrate strength and heat shock resistance. However, the development of a “diffused junction method”, replacing the previous “wax bonding method”, and a small waved foil has overcome these problems. This diffused junction method made it possible to strengthen the contact points between the inner waved foil and the rolled foil compared with previous substrates. It was also found that heat shock resistance at high temperature can be much improved by applying a slight wave to the foil instead of using a plane foil.