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Technical Paper

Thermo-Mechanical Reliability of Nano-Silver Sintered Joints versus Lead-Free Solder Joints for Attaching Large-Area Silicon Devices

2010-11-02
2010-01-1728
Nano-silver sintered bonding was carried out at 275°C and under 3MPa pressures, and soldering in a vacuum reflowing oven to reduce voiding. Both joints are subject to large shear stresses due to the mismatch in coefficients of thermal expansion (CTE) between the chip and the substrate. In this study, residual stresses in the chip-on-substrate assemblies were determined by measuring the bending curvatures of the bonded structures. An in-house optical setup measured the bending curvatures using a thin-film stress measurement technique. From the measured bending curvatures and the mechanical properties of the constituent materials, residual stresses were calculated. The thermo-mechanical reliabilities of both joining techniques were tested by thermal cycling. The chip assemblies were cycled between -40°C and 125°C (100 minutes of cycle time, 10 minutes of dwell time) and the changes in their bending curvatures were measured.
Technical Paper

A Multi-Modality Image Data Collection Protocol for Full Body Finite Element Model Development

2009-06-09
2009-01-2261
This study outlines a protocol for image data collection acquired from human volunteers. The data set will serve as the foundation of a consolidated effort to develop the next generation full-body Finite Element Analysis (FEA) models for injury prediction and prevention. The geometry of these models will be based off the anatomy of four individuals meeting extensive prescreening requirements and representing the 5th and 50th percentile female, and the 50th and 95th percentile male. Target values for anthropometry are determined by literature sources. Because of the relative strengths of various modalities commonly in use today in the clinical and engineering worlds, a multi-modality approach is outlined. This approach involves the use of Computed Tomography (CT), upright and closed-bore Magnetic Resonance Imaging (MRI), and external anthropometric measurements.
Journal Article

A High-Resolution Surface Image Capture and Mapping System for Public Roads

2017-03-28
2017-01-0082
This paper presents a system designed to develop a high-resolution map of public roads by capturing high-resolution surface images. Unlike conventional system, the proposed system applies a field programmable gate array (FPGA) to synchronize camera, Inertial Measurement Unit (IMU), and Global Positioning System (GPS) by using FPGA’s high clock frequency and flexibility to multiple devices. The proposed system, which can be mounted on a regular vehicle, contains a Complementary Metal–Oxide–Semiconductor (CMOS) camera which can achieve 0.006 ms shutter speed and 150 fps frame rate. This camera’s high shutter speed and high frame rate can help capturing images with overlapping region at fast driving speed so that no area is missing from road surface image capturing.
Technical Paper

Does the Interaction between Vehicle Headlamps and Roadway Lighting Affect Visibility? A Study of Pedestrian and Object Contrast

2020-04-14
2020-01-0569
Vehicle headlamps and roadway lighting are the major sources of illumination at night. These sources affect contrast - defined as the luminance difference of an object from its background - which drives visibility at night. However, the combined effect of vehicle headlamps and intersection lighting on object contrast has not been reported previously. In this study, the interactive effects of vehicle headlamps and overhead lighting on object contrast were explored based on earlier work that examined drivers’ visibility under three intersection lighting designs (illuminated approach, illuminated box, and illuminated approach + box). The goals of this study were to: 1) quantify object luminance and contrast as a function of a vehicle’s headlamps and its distance to an intersection using the three lighting designs; and, 2) to assess whether contrast influences visual performance and perceived visibility in a highly dynamic intersection environment.
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