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Technical Paper

Assessment of High-Temperature Encapsulants for Planar Packages

2010-11-02
2010-01-1729
Seven encapsulants with operating temperatures up to 250°C were surveyed for use in planar packages for wide-bandgap dice. Two of the encapsulants failed processability test because they were not able to flow, and another two failed because they induced voids or cracks after curing. The dielectric results of the remaining three encapsulants showed that both dielectric strength and permittivity decreased almost 40% when the temperature was increased up to 250°C. As the three encapsulants were used to encapsulate a power module, it was proven that all of them could protect the package from early breakdown caused by the poor dielectric strength of air.
Technical Paper

Thermo-Mechanical Reliability of Nano-Silver Sintered Joints versus Lead-Free Solder Joints for Attaching Large-Area Silicon Devices

2010-11-02
2010-01-1728
Nano-silver sintered bonding was carried out at 275°C and under 3MPa pressures, and soldering in a vacuum reflowing oven to reduce voiding. Both joints are subject to large shear stresses due to the mismatch in coefficients of thermal expansion (CTE) between the chip and the substrate. In this study, residual stresses in the chip-on-substrate assemblies were determined by measuring the bending curvatures of the bonded structures. An in-house optical setup measured the bending curvatures using a thin-film stress measurement technique. From the measured bending curvatures and the mechanical properties of the constituent materials, residual stresses were calculated. The thermo-mechanical reliabilities of both joining techniques were tested by thermal cycling. The chip assemblies were cycled between -40°C and 125°C (100 minutes of cycle time, 10 minutes of dwell time) and the changes in their bending curvatures were measured.
Technical Paper

Reliability Analysis of an Automotive Wheel Assembly

1993-03-01
930406
The incorporation of reliability theory into a fatigue analysis algorithm is studied. This probabilistic approach gives designers the ability to quantify “real world” variations existing in the material properties, geometry, and loading of engineering components. Such information would serve to enhance the speed and accuracy of current design techniques. An automobile wheel assembly is then introduced as an example of the applications of this durability/reliability design package.
Technical Paper

Low Cycle Fatigue Properties of Al-Si Eutectic Alloys

1997-02-24
970704
The effect of Si-phase on the axial, low-cycle fatigue behavior of Al-Si eutectic alloys was investigated using test specimens prepared from alloys processed either by continuous casting or extrusion. Results indicate that, for continuous casting, all fatigue fractures resulted from shear-type crack initiation and propagation with an attendant shortening of fatigue life. For extruded material, fatigue cracks originated in the Si phase. In both instances, initiation and growth mechanisms were essentially identical to those observed in high-cycle fatigue. Cyclic properties obtained from phenomenological models are presented and discussed.
Technical Paper

Advanced Castings Made Possible Through Additive Manufacturing

2017-03-28
2017-01-1663
Binder jetting of sand molds and cores for metal casting provides a scalable and efficient means of producing metal components with complex geometric features made possible only by Additive Manufacturing. Topology optimization software that can mathematically determine the optimum placement of material for a given set of design requirements has been available for quite some time. However, the optimized designs are often not manufacturable using standard metal casting processes due to undercuts, backdraft and other issues. With the advent of binder-based 3D printing technology, sand molds and cores can be produced to make these optimized designs as metal castings.
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