This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers an electrically-conductive adhesive supplied as two components; a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers four types of glass cloth (See 3.1) coated on both sides with a flexible, vinyl-copolymer resin, the type of glass cloth varying with nominal thickness of the product.
This specification covers four types of glass cloth (See 3.1) coated on both sides with a flexible, vinyl-copolymer resin, the type of glass cloth varying with nominal thickness of the product.
This specification establishes the requirements, controls, procedures, and quality assurance requirements for fabrication of flat, adhesive-bonded, aluminum-alloy-faced sandwich structure panels using one of three basic core materials: paper honeycomb, polyurethane foam, or aramid-paper-base honeycomb.
This specification establishes the requirements, controls, procedures, and quality assurance requirements for fabrication of flat, adhesive-bonded, aluminum-base-alloy-faced sandwich structure panels using one of three basic core materials: paper honeycomb, polyurethane foam, or nylon paper base honeycomb.
This specification covers a heat-reactive, thermosetting, epoxy resin matrix in the form of a semi-solid. The resin matrix thermally cures to an epoxy polymer.