This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
This specification covers a flexibilized epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
This specification covers a flexibilized epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
This specification covers a flexibilized epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
This specification covers filled, resinous, thermosetting compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.
This specification covers filled, resinous, thermosetting compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.
This specification covers filled, thermosetting resin compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.
This specification covers filled, thermosetting resin compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.
This specification covers filled, thermosetting resin compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.
This specification covers filled, resinous, thermosetting compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.