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This paper investigates the application of thick film hybrid circuit technology on ceramic substrate in comparison to the main stream substrate FR-4 (Flame Retardant 4) for PCB implementation. The study is based on computer models for these very substrates in order to simulate the propagation of heat through convection and conduction within the material boundaries. In order to simulate electronic components surface mounted, different heat sources are randomly arranged on physical contact to the surface of the material under investigation. The results emphasize and discern the usage of both substrates and its most suitable environment verifying the application towards vehicular integration. Future study may include experimental analysis for simulated data verification and validation of thick film hybrid circuit technology for the automotive industry.