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Technical Paper

Implementation of Lead-Free Solder for Automotive Electronics

2000-03-06
2000-01-0017
Lead-free solders for electronics have been actively pursued since the early 1990's here and abroad for environmental, legislative, and competitive reasons. The National Center for Manufacturing Sciences (NCMS-US)1, the International Tin Research Institute (ITRI-UK)2, Swedish Institute of Production Engineering Research (IVF-Sweden)3, Japan Institute of Electronics Packaging (JIEP Japan)4, Improved Design Life and Environmentally Aware Manufacture of Electronics Assemblies by Lead-free Soldering (IDEALS-Europe)5, and, more recently, the National Electronics Manufacturing Initiative (NEMI-US)6 have been aggressively seeking lead-free solutions The automotive industry has some unique requirements that demand extensive testing of new materials and processes prior to implementation. The specific steps taken at Delphi Automotive Systems with lead-free solder will be described along with the lessons learned along the way.
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