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Technical Paper

Reliability of Resonant Micromachined Sensors and Actuators

2001-03-05
2001-01-0618
There are an increasing number of applications for resonant micromachines. Accelerometers, angular rate sensors, voltage controlled oscillators, pressure and chemical sensors have been demonstrated using this technology. Several of these devices are employed in vehicles. Vibrating devices have been made from silicon, quartz, GaAs, nickel and aluminum. Resonant microsystems are in constant motion and so present new challenges in the area of reliability for vehicular applications. The impact of temperature extremes, cyclic fatigue, stiction, thermal and mechanical shock on resonant device performance is covered.
Technical Paper

Maximum Electrical Energy Availability With Reasonable Components

2000-11-01
2000-01-C071
The electric power required in automotive systems is quickly reaching a level that significantly impacts costs and fuel consumption. This drives the need to reconsider an electric energy management function. Fast evolving factors such as increasing power usage, and stricter engine management and reliability requirements necessitate a global vehicle approach to energy management. Innovations such as new powernet concepts (42 volt or dual voltage systems), new component technologies (high-performance energy storage, high efficiency and controllable generators), and global electronic and software architecture concepts will enable this new energy management concept. This paper describes key issues to maximize energy availability with reasonable components.
Technical Paper

Thermal Electric Analysis of Bond Wires Used in Automotive Electronic Modules

2015-04-14
2015-01-0195
Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.
Technical Paper

Multiple Environment Accelerated Reliability Test Development

1999-10-10
1999-01-3387
The four major discriminators for products in the market place are Technology, Quality,1 Cost and Delivery. Effective measurement systems and initial design quality have the largest impact on delivered field quality, program development cost and timing, as well as customer enthusiasm. System-level reliability testing methods have a major impact on the business health of any product. The implementation of laboratory forced failure testing in simultaneously applied energy environments has the largest influence for "designing in" field reliability and lowering development cost. Clearly a policy change from success based testing to forced failure testing has had the largest impact on results for the consumer.
Technical Paper

Diagnostic Strategies for Advanced Automotive Systems

2002-10-21
2002-21-0024
In recent years, the desire for improved vehicle performance, reliability and safety have increased the electrical content and its complexity in vehicles. Advanced automotive systems integrate sensors, controllers, actuators and communication networks. To maintain safety and reliability, a comprehensive system of diagnostics and physical and analytic redundancy are used. In some cases, diagnostic strategies based on analytical redundancy can provide detection, as well as fault-tolerance, and may provide benefits in cost, packaging, flexibility and reusability. This paper discusses a range of diagnostic methods and their applicability to advanced automotive systems such as X-by-Wire. It will also show the reduction to practice of an advanced analytical technique for an automotive application.
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