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The fundamental relationship between semi-solid processing and microstructure and their effect on the flow characteristics of semi-solid metals have been studied for several years. However, how the process related microstructure influences fatigue properties has not been given the same attention. This study examines the influence of process-related microstructure on the fatigue properties of semi-solid formed A357 alloys. High-solid-fraction (62% solid) and low-solid-fraction (31% and 36% solid) semi-solid formed A357 was tested in axial fatigue with a stress ratio (R) equal to -1. The high solid fraction (HSF) material had better fatigue properties than the low solid fraction (LSF) material. This is attributed to the fatigue crack initiation mechanisms, as related to the fatigue crack initiation features and the strengths of the materials.

There are an increasing number of applications for resonant micromachines. Accelerometers, angular rate sensors, voltage controlled oscillators, pressure and chemical sensors have been demonstrated using this technology. Several of these devices are employed in vehicles. Vibrating devices have been made from silicon, quartz, GaAs, nickel and aluminum. Resonant microsystems are in constant motion and so present new challenges in the area of reliability for vehicular applications. The impact of temperature extremes, cyclic fatigue, stiction, thermal and mechanical shock on resonant device performance is covered.

The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.

Several heater cores failed due to erosion by cavitation. After analysis, most of failures were explained by the presence of impurities in the heater core. It was then decided with the customer to use CFD simulation in order to prove that the cavitation was not caused by design concept of the tank. In this paper, we present the results of heater core simulations done in 2D and in 3D with Fluent. The objective is to simulate the pressure and velocity distribution within the heater core and to verify if the zones of low pressure are below the saturation vapour pressure of the fluid causing cavitation. In these areas, the deterioration of the tubes might occur due to erosion by cavitation.

In the catalytic converter, the thermal conductivity of the insulation material (intumescent mat) placed between the ceramic catalyst and the metal shell is strongly dependent on the temperature, resulting in the solving of non-linear heat conduction equations. In this paper, the analytic solution for the steady heat flow in a cylinder with temperature dependent conductivity is given. Using this analytic solution for the mat and including convection and radiation at the converter skin, an analytical expression for calculating converter skin temperature is obtained. This expression can be easily incorporated in a Fortran code to calculate the temperatures.

Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.