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A major part of product development is to validate robustness to the environment (e.g. temperature, vibration, EMC). Although much time and expense is spent doing so, using traditional approaches often leads to “feel good” results since the product “passes”. Such a false sense of security is misleading since such validation methods can have serious deficiencies. Presented is a Design Assurance process (Accelerated Stress Assurance Plan - ASAP) to validate modules that addresses these deficiencies. It places major emphasis on the analysis and development stages. It does not require large sample sizes, and overall test time and facilities is reduced (30-50% possible).. Just as for electronic modules, new and major changes to IC's need a shorter validation process. As an example, a relatively fast procedure for the production and application release of improved molding compounds for IC's is presented.