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High Temperature Power Device and Packaging - The Technology Leap to Achieve Cost, Power Density and Reliability Target

2011-11-07
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.
Video

Supplier Discussions - 2012

2012-03-29
Seven different suppliers will discuss their latest technologies. Panelist Jon Bereisa, Auto Lectrification LLC John Burgers, Dana Canada Corporation Derek De Bono, Valeo Dusan Graovac, Infineon Technologies AG Ronald P. Krupitzer, American Iron and Steel Institute Timothy J. Lawler, Bosch Corp. Ian M. Sharp, Flybrid Systems LLP
Technical Paper

Timing Analysis and Tracing Concepts for ECU Development

2014-04-01
2014-01-0190
Integration scenarios for ECU software become more complicated, as more constraints with regards to timing, safety and security need to be considered. Multi-core microcontrollers offer even more hardware potential for integration scenarios. To tackle the complexity, more and more model based approaches are used. Understanding the interaction between the different software components, not only from a functional but also from a timing view, is a key success factor for high integration scenarios. In particular for multi-core systems, an amazing amount of timing data can be generated. Usually a multi-core system handles more software functionality than a single-core system. Furthermore, there may be timing interference on the multicore systems, due to the shared usage of buses, memory banks or other hardware resources.
Technical Paper

Efficient Multi-Core Software Design Space Exploration for Hybrid Control Unit Integration

2014-04-01
2014-01-0260
Multi-core systems are adopted quickly in the automotive domain, Proof of concepts have been implemented for power train, body and chassis, involving hard real-time constraints. However, depending on the degree of integration, it can be costly, especially in those cases where existing single-core software has to be migrated over. Furthermore, there seems to be a high level of uncertainty, whether a found solution, with regards to partitioning, mapping and orchestration of software is close to an optimum solution. Some integrated solutions demonstrate considerably less performance, for instance due to communication overhead compared to execution on single-core systems. This paper discusses a methodology, as to how to effectively and efficiently investigate the software architecture design space for multi-core software development.
Technical Paper

High Performance Processor Architecture for Automotive Large Scaled Integrated Systems within the European Processor Initiative Research Project

2019-04-02
2019-01-0118
Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive.
Technical Paper

μAFS High Resolution ADB/AFS Solution

2016-04-05
2016-01-1410
A cooperation of several research partners supported by the German Federal Ministry of Research and Education proposes a new active matrix LED light source. A multi pixel flip chip LED array is directly mounted to an active driver IC. A total of 1024 pixel can be individually addressed through a serial data bus. Several of these units are integrated in a prototype headlamp to enable advanced light distribution patterns in an evaluation vehicle.
Technical Paper

Embedded System Tool to Support Debugging, Calibration, Fast Prototyping and Emulation

2004-03-08
2004-01-0304
Infineon's latest high-end automotive microcontrollers like TC1796 are complex Systems On Chip (SoC) with two processor cores and up to two internal multi-master buses. The complex interaction between cores, peripherals and environment provides a big challenge for debugging. For mission critical control like engine management the debugging approach must not be intrusive. The provided solution are dedicated Emulation Devices which are able to deal with several 10 Gbit/s of raw internal trace data with nearly no cost adder for mass production and system design. Calibration, which is used later in the development cycle, has different requirements, but is covered by the Emulation Devices as well. The architecture of TC1796ED comprises the unchanged TC1796 silicon layout, extended by a full In-Circuit Emulator (ICE) and calibration overlay memory on the same die. In most cases, the only debug/calibration tool hardware needed is a USB cable.
Technical Paper

Smart IGBT's for Advanced Distributed Ignition Systems

2004-03-08
2004-01-0518
Driven by factors like consumption, power output per liter, comfort and more stringent exhaust gas standards the powertain control area, has developed rapidly in the last decades. This trend has also brought with it many innovations in the ignition application. Today we can see a trend to Pencil-coil or Plug-top-coil ignition systems. The next step in system partitioning is to remove the power driver from the ECU and place it directly in/on the coil body. The advantages of the new partitioning - e.g. no high voltage wires, reduced power dissipation on the ECU - are paid with different, mainly tougher requirements for the electronic components. By using specialized technologies for the different functions - IGBT for switching the power, SPT for protection, supply and diagnostics - in chip-on-chip technology all required functions for a decentralized ignition system can be realized in a TO220/ TO263 package.
Technical Paper

Seamless Solution for Electronic Power Steering

2006-04-03
2006-01-0593
The number of safety critical automotive applications employing high current brushless motors continues to increase (Steering, Braking, and Transmission etc.). There are many benefits when moving from traditional solutions to electrically actuated solutions. Some of these benefits can include increased fuel economy, simplified vehicle installation and packaging, increased feature set, improved safety and/or convenience, simplified unit assembly and modular testability prior as well as during vehicle manufacturing. The trend to implement brushless motors in these applications (which require electronically controlled commutation) has also brought with it the need for powerful inverters, which primarily consist of Power MOSFETs and MOSFET Driver ICs. This paper reviews the challenges associated with the design of safety critical electronic systems which combine sensing, control and actuation.
Technical Paper

Design Considerations for Power Electronics in HEV Applications

2007-04-16
2007-01-0277
Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.
Technical Paper

Advanced Gasoline Engine Management Platform for Euro IV & CHN IV Emission Regulation

2008-06-23
2008-01-1704
The increasingly stringent requirements in relation to emission reduction and onboard diagnostics are pushing the Chinese automotive industry toward more innovative solutions and a rapid increase in electronic control performance. To manage the system complexity the architecture will require being well structure on hardware and software level. The paper introduces GEMS-K1 (Gasoline Engine Management System - Kit 1). GEMS-K1 is a platform being compliant with Euro IV emission regulation for gasoline engines. The application software is developed using modeling language, the code is automatically generated from the model. The driver software has a well defined structure including microcontroller abstraction layer and ECU abstraction layer. The hardware is following design rules to be robust, 100% testable and easy to manufacture. The electronic components use the latest innovation in terms of architecture and technologies.
Technical Paper

Cost Efficient Integration for Decentralized Automotive ECU

2004-03-08
2004-01-0717
As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.
Technical Paper

Innovative Chip Set for Pressure and Acceleration Based Airbag Solutions

2004-03-08
2004-01-0846
More and more passenger cars are equipped with passive side protection systems such as thorax airbags for front and rear passengers. In the past, side airbag protection systems used sensors based on acceleration measurements [1]. In the meantime different sensor principles have been tested in order to increase the performance of this application. The intention has been to achieve faster firing decisions and to decrease the misuse risk for a floor or chassis impact. This paper presents the partitioning of an advanced chipset for pressure and acceleration based airbag systems. It shows the communication link between the sensors, the receiver-IC and other blocks in the application.
Technical Paper

LED Modules for Matrix and Pixel Light Solutions - On the Way to New Features in Headlight Systems

2014-04-01
2014-01-0432
Glare-free high beams are a consistent enhancement of adaptive headlight systems for vehicles with advanced driver assist systems. A prerequisite for these are camera-based systems with the ability to recognize and classify objects such as vehicles in front or oncoming vehicles when driving at night. These objects can then be dynamically masked out of the high beam of the specially designed headlights. Since we are talking about moving objects, it is essential for the high beam to be continuously and dynamically adapted. This paper describes a modular LED matrix system for dynamically adjusting a glare-free and continuously active high beam. The main focus was on the modularity of the system and the optimization of the thermal properties of an LED matrix in order to ensure that operation was reliable under the harsh environmental conditions inside a headlight. Specific control electronics and different interconnection methods were examined.
Technical Paper

Motor Control in Auxiliary Drive Systems How to Choose the Best Fitting Electronic Solution

2014-04-01
2014-01-0323
In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.
Technical Paper

High-End Automotive Servo Drives

2000-03-06
2000-01-0135
The importance of electrical motors in the automotive industry is growing. Besides standard brushed DC motors, mainly found in body and convenience areas, multiphase unipolar BLDC motors, generally used in open loop pump drives and HVAC applications, are becoming more and more widespread. These technologies have been around for some years now and are quite well covered. As well as AC induction motors, some emerging applications (mainly in the areas of powertrain and chassis control) implement permanent magnet synchronous motors with closed loop and vector-controlled technology. These applications call for a new drive concept. This paper analyzes the various requirements and proposes a suitable concept.
Technical Paper

X-by-Wire: Opportunities, Challenges and Trends

2003-03-03
2003-01-0113
This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.
Technical Paper

Microsecond Bus (μSB): The New Open-Market Peripheral Serial Communication Standard

2005-04-11
2005-01-0057
For the past approximately 20 years, the Serial Peripheral Interface (SPI) has been the established standard for serial communication between a host or central microprocessor and peripheral devices. This standard has been used extensively in control modules covering the entire spectrum of automotive applications, as well as non-automotive applications. As the complexity of engine control modules grows, with the number of vehicle actuators being controlled and monitored increasing, the number of loads the central microprocessor has to manage is growing accordingly. These loads are typically controlled using discrete and pulse-width modulated (PWM) outputs from the microcontroller when real-time operation is essential or via SPI when real-time response is not critical. The increase of already high pin-count on microcontrollers, the associated routing effort and demand for connected power stages is a concern of cost and reliability for future ECU designs.
Technical Paper

Giant Magneto Resistors - Sensor Technology and Automotive Applications

2005-04-11
2005-01-0462
The paper will give an introduction to the principle of the giant magneto resistive - GMR - effect and the silicon system integration of GMR sensors. The two main applications of a GMR as a magnetic field strength sensor and as an angular field direction sensor will be discussed under consideration of automotive requirements. The typical applications of a magnetic field strength GMR sensor in incremental position and speed sensing and those of GMR angular field sensors in position sensing will be summarized. Finally advantages of GMR in those applications will be discussed and conclusions on the use of GMR in automotive sensing will be drawn.
Technical Paper

Feasibility Study for a Secure and Seamless Integration of Over the Air Software Update Capability in an Advanced Board Net Architecture

2016-04-05
2016-01-0056
Vehicle manufacturers are challenged by rising costs for vehicle recalls. A major part of the costs are caused by software updates. This paper describes a feasibility study on how to implement software update over the air (SOTA) in light vehicles. The differences and special challenges in the automotive environment in comparison to the cellular industry will be explained. Three key requirements focus on the drivers’ acceptance and thus are crucial for the vehicle manufacturers: SOTA must be protected against malicious attacks. SOTA shall interfere as little as possible with the availability of a vehicle. Long update processes with long vehicle downtimes or even complete fails must be avoided. The functional safety of the vehicle during operation may not be limited in any way The study gives options how those objectives can be achieved. It considers the necessary security measures and describes the required adaptations of the board-net architectures both on software and hardware level.
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