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High Temperature Power Device and Packaging - The Technology Leap to Achieve Cost, Power Density and Reliability Target

2011-11-07
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.
Journal Article

Mode-Dynamic Task Allocation and Scheduling for an Engine Management Real-Time System Using a Multicore Microcontroller

2014-04-01
2014-01-0257
A variety of methodologies to use embedded multicore controllers efficiently has been discussed in the last years. Several assumptions are usually made in the automotive domain, such as static assignment of tasks to the cores. This paper shows an approach for efficient task allocation depending on different system modes. An engine management system (EMS) is used as application example, and the performance improvement compared to static allocation is assessed. The paper is structured as follows: First the control algorithms for the EMS will be classified according to operating modes. The classified algorithms will be allocated to the cores, depending on the operating mode. We identify mode transition points, allowing a reliable switch without neglecting timing requirements. As a next step, it will be shown that a load distribution by mode-dependent task allocation would be better balanced than a static task allocation.
Journal Article

DSI3 Sensor to Master Decoder using Symbol Pattern Recognition

2014-04-01
2014-01-0252
The newly released Distributed System Interface 3 (DSI3) Bus Standard specification defines three modulation levels form which 16 valid symbols are coded. This complex structure is best decoded with symbol pattern recognition. This paper proposes a simplification of the correlation score calculation that sharply reduces the required number of operations. Additionally, the paper describes how the pattern recognition is achieved using correlation scores and a decoding algorithm. The performance of this method is demonstrated by mean of simulations with different load models between the master and the sensors and varying noise injection on the channel. We prove than the pattern recognition can decode symbols without any error for up to 24dBm.
Journal Article

On-Chip Delta-Sigma ADC for Rotor Positioning Sensor Application (Resolver-to-Digital Converter)

2014-04-01
2014-01-0333
This paper discusses the RDC method utilizing delta-sigma analog-to-digital converter hardware module (DSADC) integrated in the Infineon's microcontroller family. With its higher resolution capability when compared to the regularly used ADC with successive-approximation (SAR), DSADC seems to have more potential. On the other hand, DSADC's inherent properties, such as asynchronous sampling rate and group delay, which when not handled properly, would have negative effects to the rotor positioning system. The solution to overcome those side-effects involves utilization of other internal microcontroller's resources such as timers and capture units, as well as additional software processing run inside CPU. The rotor positioning system is first modeled and simulated in high-level simulation language environment (Matlab and Simulink) in order to predict the transient- and steady state behaviors. The group delay itself is obtained by simulating the model of DSADC module implementation.
Technical Paper

Design Considerations for Power Electronics in HEV Applications

2007-04-16
2007-01-0277
Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.
Technical Paper

Advanced Gasoline Engine Management Platform for Euro IV & CHN IV Emission Regulation

2008-06-23
2008-01-1704
The increasingly stringent requirements in relation to emission reduction and onboard diagnostics are pushing the Chinese automotive industry toward more innovative solutions and a rapid increase in electronic control performance. To manage the system complexity the architecture will require being well structure on hardware and software level. The paper introduces GEMS-K1 (Gasoline Engine Management System - Kit 1). GEMS-K1 is a platform being compliant with Euro IV emission regulation for gasoline engines. The application software is developed using modeling language, the code is automatically generated from the model. The driver software has a well defined structure including microcontroller abstraction layer and ECU abstraction layer. The hardware is following design rules to be robust, 100% testable and easy to manufacture. The electronic components use the latest innovation in terms of architecture and technologies.
Technical Paper

Non-standard CAN Network Topologies Verification at High Speed Transmission Rate using VHDL-AMS

2010-04-12
2010-01-0688
This paper considers the verification of non-standard CAN network topologies of the physical layer at high speed transmission rate (500.0Kbps and 1.0Mbps). These network topologies including single star, multiple stars, and hybrid topologies (multiple stars in combination with linear bus or with ring topology) are simulated by using behavior modeling language (VHDL-AMS) in comparison to measurement. Throughout the verification process, CAN transceiver behavioral model together with other CAN physical layer simulation components have been proved to be very accurate. The modeling of measurement environment of the CAN network is discussed, showing how to get the measurement and simulation results well matched. This demonstrates that the simulation solution is reliable, which is highly desired and very important for the verification requirement in CAN physical layer design.
Technical Paper

In-vehicle Network Verification from Application to Physical Layer

2004-03-08
2004-01-0208
The verification of an in-vehicle network often requires to look at more than one level of abstraction at a time. At the moment, this is not addressed by existing methods, which are dedicated either to physical or application layer, but not both. This paper fills this gap by introducing a methodology to insert the protocol related software execution as well as the motor behavior into the physical layer mixed-signal (i.e. analog/digital) simulation. Electronics and mechanics are covered by the hardware description language VHDL-AMS, while the software is given in C.
Technical Paper

Embedded System Tool to Support Debugging, Calibration, Fast Prototyping and Emulation

2004-03-08
2004-01-0304
Infineon's latest high-end automotive microcontrollers like TC1796 are complex Systems On Chip (SoC) with two processor cores and up to two internal multi-master buses. The complex interaction between cores, peripherals and environment provides a big challenge for debugging. For mission critical control like engine management the debugging approach must not be intrusive. The provided solution are dedicated Emulation Devices which are able to deal with several 10 Gbit/s of raw internal trace data with nearly no cost adder for mass production and system design. Calibration, which is used later in the development cycle, has different requirements, but is covered by the Emulation Devices as well. The architecture of TC1796ED comprises the unchanged TC1796 silicon layout, extended by a full In-Circuit Emulator (ICE) and calibration overlay memory on the same die. In most cases, the only debug/calibration tool hardware needed is a USB cable.
Technical Paper

Smart IGBT's for Advanced Distributed Ignition Systems

2004-03-08
2004-01-0518
Driven by factors like consumption, power output per liter, comfort and more stringent exhaust gas standards the powertain control area, has developed rapidly in the last decades. This trend has also brought with it many innovations in the ignition application. Today we can see a trend to Pencil-coil or Plug-top-coil ignition systems. The next step in system partitioning is to remove the power driver from the ECU and place it directly in/on the coil body. The advantages of the new partitioning - e.g. no high voltage wires, reduced power dissipation on the ECU - are paid with different, mainly tougher requirements for the electronic components. By using specialized technologies for the different functions - IGBT for switching the power, SPT for protection, supply and diagnostics - in chip-on-chip technology all required functions for a decentralized ignition system can be realized in a TO220/ TO263 package.
Technical Paper

Cost Efficient Integration for Decentralized Automotive ECU

2004-03-08
2004-01-0717
As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.
Technical Paper

Smart IGBT for Advanced Ignition Systems

2001-03-05
2001-01-1220
Increasing fuel costs and emission regulations force the car manufacturers to develop powerful but efficient engines. The 3-liter car (3-liter/100 km fuel consumption → 80 miles/gallon) is one of the slogans. To fulfill these requirements a fully electronic controlled Engine Management is necessary. Carburetor systems are replaced by fuel injection systems. Direct injection for Diesel as well as for gasoline engines is the clear trend for the future. The mechanical throttle systems, used for a long time will not fit to the requirements of direct injection. A DC motor for electronic throttle control in conjunction with λ regulation and exhaust gas recirculation are the key elements for low emission cars. Also the automotive ignition system is in a process of change today.
Technical Paper

Diagnostic and Control Systems for Automotive Power Electronics

2001-03-05
2001-01-0075
The recent improvements in automotive electronics have had a tremendous impact on safety, comfort and emissions. But the continuous increase of the volume of electronic equipment in cars (representing more than 25% of purchasing volume) as well as the increasing system complexity represent a new challenge to quality, post-sales customer support and maintenance. Identifying a fault in a complex network of ECUs, where the different functions are getting more and more intricate, is not an easy task. It can be shown that with the levels of reliability common in 1980, an upper-range automobile of today could never function fault-free. On-Board-Diagnostics (OBD) concepts are emerging to assist the maintenance personnel in localizing the source of a problem with high accuracy, reducing the vehicle repair time, repair costs and costs of warranty claims.
Technical Paper

Seamless Solutions for Powertrain Systems

2002-03-04
2002-01-1303
Fuel efficiency and clean combustion engine versus high engine performance - which will increase up to factor 10 in the next 5 years - with less engine displacement are driving more complex engine control systems in today's and future vehicles. The challenge is not only to design a perfect engine, but also to incorporate the right semiconductors. Beside this demand on high sophisticated electronics the demand on cost reduction - especially for small cars - is one driving factor for a smart partitioning. Infineon offers sensors, microcontrollers and power semiconductors for today's engine management platforms and therefore owns the right technologies to manufacture those devices. This opens up the possibility to integrate more functionality in less devices as in today's partitioning or to define electronics to simplify complex control strategies and to optimize the performance of each device.
Technical Paper

The BRAKE Project - Centralized Versus Distributed Redundancy for Brake-by-Wire Systems

2002-03-04
2002-01-0266
This paper presents the objectives and preliminary results of the BRAKE project - a joint effort of Delphi Automotive Systems, Infineon Technologies, Volvo Car Corporation and WindRiver. The objective of this project is to use microelectronics technologies to design a distributed Brake-by-Wire system including: A distributed fault tolerant system for enhanced safety An extension of the OSEK based operating system for a distributed time triggered architecture An open interface between vehicle control, and brake system control The results comprise the requirements, interface specification (see [1]), a full simulation model, a hardware-in-the-loop bench, and a demonstration vehicle. The application has been developed using advanced automatic code generation for Infineon's TriCore based automotive microcontrollers.
Technical Paper

Integrated Mechatronic Design and Simulation of a Door Soft Close Automatic with Behavioral Models of Smart Power ICs

2002-03-04
2002-01-0564
Based on the example of a door soft close automatic the potential of integrated system simulation in the automotive systems development is demonstrated. The modeling approach is covering several physical domains like mechanics, electromagnetics and semiconductor physics. With adequate simplifying methods a time efficient model is generated, which allows system optimization in the concept phase. Time consuming redesigns can thus be minimized.
Technical Paper

System-Level Partitioning Using Mission-Level Design Tool for Electronic Valve Application

2003-03-03
2003-01-0865
In defining innovative and cost-effective chip sets for future automotive applications, system architects need high-level tools that allow them to rapidly determine the best silicon partitioning for a given application in terms of system performance as well as cost. The tool needs to be flexible, modular, and swift such that the system designer can perform abstract simulation iterations quickly for various functional partitioning scenarios, without requiring excessive computer resources. The tool must also be portable and adaptable to provide a simulation environment suitable to systems- or car-manufacturers for in-depth applications simulation and architecture assessment. The semiconductor component definition process using such a “mission-level” design tool for the automotive application electronic valve will be demonstrated. Methods for the analysis of electronic valve control system architectures using mission-level simulation will be developed.
Technical Paper

Mechatronic Solution for Electronic Turbocharger

2003-03-03
2003-01-0712
An innovative way of lowering engine fuel consumption is to reduce engine displacement. However, smaller engines featuring reduced swept volume typically exhibit insufficient torque at low engine speeds. Conventional exhaust turbochargers are not able to compensate for this behavior and additionally suffer from the familiar turbo lag. One possible solution may be an electrically assisted turbocharger, with a high-speed motor providing the extra boost at low engine speeds. A critical factor for the efficiency of the concept is the ratio of the electric motor torque and the rotational mass inertia of the rotor. Testbench evaluation shows acceleration times of 0.5 seconds to reach speeds up to 70,000 rpm. Typically, the electrical load of such systems goes up to 3 kW. Target motors are various types of electrically commutated motors such as BLDC, switched reluctance or induction motors.
Technical Paper

Cyber Security in the Automotive Domain – An Overview

2017-03-28
2017-01-1652
Driven by the growing internet and remote connectivity of automobiles, combined with the emerging trend to automated driving, the importance of security for automotive systems is massively increasing. Although cyber security is a common part of daily routines in the traditional IT domain, necessary security mechanisms are not yet widely applied in the vehicles. At first glance, this may not appear to be a problem as there are lots of solutions from other domains, which potentially could be re-used. But substantial differences compared to an automotive environment have to be taken into account, drastically reducing the possibilities for simple reuse. Our contribution is to address automotive electronics engineers who are confronted with security requirements. Therefore, it will firstly provide some basic knowledge about IT security and subsequently present a selection of automotive specific security use cases.
Technical Paper

Timing Correctness in Safety-Related Automotive Software

2011-04-12
2011-01-0449
Automotive applications classed as safety-related or safety-critical are now important differentiating technologies in the automotive industry. The emergence of safety standard ISO 26262 underlines the increasing importance of safety in automotive software. As well as functional requirements, hard real-time requirements are of crucial importance to safety-related software as there is a need to prove that the system functionality is fulfilled, even in worst-case scenarios. Measurement-based WCET (Worst-Case Execution Time) analysis combines on-target timing measurements with static analysis of program structure to calculate predicted worst-case paths and times. This is in contrast to traditional end-to-end timing measurements, which give no confidence that the worst-case path is actually tested and no insight into the location of any timing problems that do emerge.
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