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The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

Multicore processor are well established in classical and tablet personal computers for some year. Such processors use more then one central core for computation and allow to integrate more computational power with smaller costs. However more than 90% of all processors worldwide are not placed in classical IT but are empedded in bigger systems like in modern vehicles or airplanes. Such systems face a very high demand in terms of safety, security an reliability which hinders the use of multicores in such systems. The funded project ARAMiS faces these demands and has the goal to enable the usability of multicore systems in the domains automotive and avionics, as well as later also railway. ARAMiS is the basis for higher traffic safety, traffic efficiency and comfort.

The newly released Distributed System Interface 3 (DSI3) Bus Standard specification defines three modulation levels form which 16 valid symbols are coded. This complex structure is best decoded with symbol pattern recognition. This paper proposes a simplification of the correlation score calculation that sharply reduces the required number of operations. Additionally, the paper describes how the pattern recognition is achieved using correlation scores and a decoding algorithm. The performance of this method is demonstrated by mean of simulations with different load models between the master and the sensors and varying noise injection on the channel. We prove than the pattern recognition can decode symbols without any error for up to 24dBm.

Recently, vehicle networks have increased complexity due to the demand for autonomous driving or connected devices. This increasing complexity requires high bandwidth. As a result, vehicle manufacturers have begun using Ethernet-based communication for high-speed links. In order to deal with the heterogeneity of such networks where legacy automotive buses have to coexist with high-speed Ethernet links vehicle manufacturers introduced a vehicle gateway system. The system uses Ethernet as a backbone between domain controllers and CAN buses for communication between internal controllers. As a central point in the vehicle, the gateway is constantly exchanging vehicle data in a heterogeneous communication environment between the existing CAN and Ethernet networks. In an in-vehicle network context where the communications are strictly time-constrained, it is necessary to measure the delay for such routing task.

Today, body vibration energy of passenger cars gets dissipated by linear working shock absorbers. A new approach substitutes the damper of a passenger car by a cardanic gimbaled flywheel mass. The constructive design leads to a rotary damper in which the vertical movement of the wheel carrier leads to revolution of the rotational axis of the flywheel. In this arrangement, the occurring precession moments are used to control damping moments and to store vibrational energy. Different damper characteristics are achieved by different induced precession. From almost zero torque output to high torque output, this damper has a huge spread. Next to the basic principal, in this paper an integration in the chassis, including a constructive proposal is shown. A conflict with high torque and high angular velocity leads to a special design. Moreover concepts to deal with all vehicle situations like yawing, rolling and pitching are shown.

Starting from the USA and followed by the European Union, legal requirements concerning “Tire Pressure Monitoring Systems” (TPMS) for passenger cars and light trucks will be introduced in China as well and therefore in the third of the three largest automobile markets worldwide. Changes of pressure dependent physical tire properties such as dynamic roll radius and a certain tire eigenfrequency, which are included in the ESC-wheel speed signals, indicates pressure loss in an indirect manner. Systems with corresponding working principles are called “indirect Tire Pressure Monitoring System” (iTPMS). Since the tire is a structural element with varying characteristics according to the design parameters, the roll radius and frequency behavior due to pressure loss is variable as well. As a consequence, tires have to be evaluated regarding there compatibility to iTPMS during the vehicle development process.

With the introduction of the ISO26262 automotive safety standard there is a burden of proof to show that the processing elements in embedded microcontroller hardware are capable of supporting a certain diagnostic coverage level, depending on the required Automotive Safety Integrity Level (ASIL). The current mechanisms used to provide actual metrics of the Built-in Self Tests (BIST) and Lock Step comparators use Register Transfer Level (RTL) simulations of the internal processing elements which force faults into individual nodes of the design and collect diagnostic coverage results. Although this mechanism is robust, it can only be performed by semiconductor suppliers and is costly. This paper describes a new solution whereby the microcontroller is synthesized into a large Field Programmable Gate Array (FPGA) with a test controller on the outside.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

More and more high-level algorithms are emerging to improve the existing systems in a car. Often these algorithms only need a platform with a bus connection and some resources such as CPU time and memory space. These functions can easily be integrated into existing systems that have free resources. This paper describes some encapsulation techniques and mechanisms that can be used in the automotive domain. The discussion also takes into account the additional resources consumed on the microcontroller to meet these requirements and by the software to implement the encapsulation mechanisms. Overviews of some general concepts of software-architectures that provide encapsulation are also shown.

The increasingly stringent requirements in relation to emission reduction and onboard diagnostics are pushing the Chinese automotive industry toward more innovative solutions and a rapid increase in electronic control performance. To manage the system complexity the architecture will require being well structure on hardware and software level. The paper introduces GEMS-K1 (Gasoline Engine Management System - Kit 1). GEMS-K1 is a platform being compliant with Euro IV emission regulation for gasoline engines. The application software is developed using modeling language, the code is automatically generated from the model. The driver software has a well defined structure including microcontroller abstraction layer and ECU abstraction layer. The hardware is following design rules to be robust, 100% testable and easy to manufacture. The electronic components use the latest innovation in terms of architecture and technologies.

Helmholtz-resonators are discussed in technical acoustics normally in conjunction with attenuation of sound, not with amplification or even production of sound. On the other hand everybody knows the sound produced by a bottle, when someone blows over the orifice. During the investigation of the sound produced in body gaps it was found that the underlying flow physics are closely related to the Helmholtz-resonator. But different from the typical Helmholtz-resonator generated noise – as for example the blown bottle or, from the automotive world, the sun roof buffeting – there is no fluid resonance involved in the process. For body gaps the random pressure fluctuation of the turbulent boundary layer is sufficient to excite the acoustic resonance in the cavity. The sound generation is characterized by a continuous rise in sound pressure level with increasing velocity, the rise is proportional to U with varying exponents.

With the ever increasing amount of available software processing resources in a vehicle, more and more high-level algorithms are emerging to improve the existing systems in a car. Often these algorithms only need a platform with a bus connection and some resources such as processing power and memory space. These functions are predestined to be integrated into existing systems that have free resources. This paper will examine the role of time protection in these multi-algorithm systems and describe what timing protection means and why it is required. The processing time will be partitioned to the different processing levels like interrupts, services and tasks. The problems of timing protection will be illustrated as well as its limitations. The conflict between real-time requirements and timing protection will be shown. Finally Autosar will be examined with focus on timing protection and applicability in actual development projects.

This paper considers the verification of non-standard CAN network topologies of the physical layer at high speed transmission rate (500.0Kbps and 1.0Mbps). These network topologies including single star, multiple stars, and hybrid topologies (multiple stars in combination with linear bus or with ring topology) are simulated by using behavior modeling language (VHDL-AMS) in comparison to measurement. Throughout the verification process, CAN transceiver behavioral model together with other CAN physical layer simulation components have been proved to be very accurate. The modeling of measurement environment of the CAN network is discussed, showing how to get the measurement and simulation results well matched. This demonstrates that the simulation solution is reliable, which is highly desired and very important for the verification requirement in CAN physical layer design.

Infineon's latest high-end automotive microcontrollers like TC1796 are complex Systems On Chip (SoC) with two processor cores and up to two internal multi-master buses. The complex interaction between cores, peripherals and environment provides a big challenge for debugging. For mission critical control like engine management the debugging approach must not be intrusive. The provided solution are dedicated Emulation Devices which are able to deal with several 10 Gbit/s of raw internal trace data with nearly no cost adder for mass production and system design. Calibration, which is used later in the development cycle, has different requirements, but is covered by the Emulation Devices as well. The architecture of TC1796ED comprises the unchanged TC1796 silicon layout, extended by a full In-Circuit Emulator (ICE) and calibration overlay memory on the same die. In most cases, the only debug/calibration tool hardware needed is a USB cable.

Driven by factors like consumption, power output per liter, comfort and more stringent exhaust gas standards the powertain control area, has developed rapidly in the last decades. This trend has also brought with it many innovations in the ignition application. Today we can see a trend to Pencil-coil or Plug-top-coil ignition systems. The next step in system partitioning is to remove the power driver from the ECU and place it directly in/on the coil body. The advantages of the new partitioning - e.g. no high voltage wires, reduced power dissipation on the ECU - are paid with different, mainly tougher requirements for the electronic components. By using specialized technologies for the different functions - IGBT for switching the power, SPT for protection, supply and diagnostics - in chip-on-chip technology all required functions for a decentralized ignition system can be realized in a TO220/ TO263 package.

In open jet wind tunnels with high blockage ratios a sharp rise in drag is observed for models approaching the nozzle exit plane. The physical background for this rise in drag will be analyzed in the paper. Starting with a basic analysis of the dependencies of the effect on model and wind tunnel properties, the key parameters of the problem will be identified. It will be shown using a momentum balance and potential flow theory that interaction between model and nozzle exit can result in significant tunnel-induced gradients at the model position. In a second step, a CFD-based investigation is used to show the interaction between nozzle exit and a bluff body. The results cover the whole range between open jet and closed wall test section interaction. The model starts at a large distance from the nozzle, then moves towards the nozzle, enters the nozzle and is finally completely inside the nozzle.

The ever increasing use of electronics in modern vehicles has not stopped at comfort systems such as power seats and power windows. Every conventional system that requires operating force will eventually be replaced by a self-powered version. One such item is the electromechanical parking brake of the new Audi A8, offering a host of new features. Despite the many options for new functions, it is nevertheless important to keep the driver in mind. Being engineers, one tends to overlook that not all customers share our excitement for gadgets and overly complicated technical features.