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Technical Paper

Comparative Studies of Adhesive Joints in Automotive

2014-04-01
2014-01-0788
Use of adhesives in automotive require in-depth material, design, manufacturing & engineering knowledge. It is also necessary to understand functional requirements. For perfect and flawless adhesive joinery, the exact quantity of adhesive, its material composition, thickness of adhesive layer, substrate preparation methods for adhesive bonding, handling and curing time of the adhesive have to be studied & optimized. This paper attempts to describe different aspects of adhesive bonding in automotive industry to include: Selection of adhesives based on application and design of the components, surface preparation of adherend, designing of adhesive joint, curing conditions of adhesives, testing and validation of adhesive joints. Emphasis was given to study & verify the performance of different adhesive joints to meet end product requirements. Samples were prepared with a variety of adhesive and adherend combinations.
Technical Paper

Tweaking Elastomer by Addition of Nano Silica in Formulation

2024-01-16
2024-26-0197
The art of rubber formulation science always has a scope for fine-tuning with changing the parameters like base polymer grade selection, filler selection, curing system/cross link density, manufacturing methods, and many. Hence forth the filler manufacturer arrived differentiation of the filler already, this paper provides a description of rubber formulation tuning for damped vibration automotive applications. Acicular spiky spherical and hollow spherical nano silica selected as filler. With the thorough knowledge of elastomeric formulation and with doping different new selected silica grades, an optimized DOE was done. New formulation development was focused on isolation characteristics without affecting other necessary properties. The different inputs for finite element calculations was studied with the effects of doping different fillers and also studied the resultant virtual output in damping coefficients.
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